AMD
XCV1000E-6BG560I

696-XCV1000E-6BG560I
PDF Datasheet
IC FPGA 404 I/O 560MBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
393216
Number of LABs/CLBs
6144
ECCN
3A991D
Number of I/O
404
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
560-MBGA (42.5x42.5)
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XCV1000E-6BG560I Description

AMD's XCV1000E-6BG560I is a high-performance integrated circuit (IC) designed for use in a variety of applications. This IC is manufactured by Advanced Micro Devices (AMD), a leading semiconductor company known for its innovative and reliable products.

Description:

The XCV1000E-6BG560I is a complex programmable logic device (CPLD) that combines the flexibility of programmable logic with the performance of an application-specific integrated circuit (ASIC). It is housed in a 560-pin ball grid array (BGA) package, making it suitable for use in a wide range of applications.

Features:

Some of the key features of the XCV1000E-6BG560I include:

  1. High-density programmable logic: The XCV1000E-6BG560I offers a high-density programmable logic fabric, allowing for the implementation of complex designs and functions.
  2. On-chip memory: The device includes on-chip memory resources, such as block RAM and distributed RAM, to support data storage and processing requirements.
  3. Digital signal processing (DSP) capabilities: The XCV1000E-6BG560I is equipped with DSP blocks, enabling it to perform high-speed mathematical operations and handle signal processing tasks efficiently.
  4. High-speed I/O: The device supports high-speed input/output (I/O) interfaces, allowing for fast data transfer rates and communication with other components in a system.
  5. Low power consumption: The XCV1000E-6BG560I is designed to operate with low power consumption, making it suitable for use in energy-efficient applications.

Applications:

The XCV1000E-6BG560I is a versatile IC that can be used in a wide range of applications, including:

  1. Telecommunications: The XCV1000E-6BG560I can be used in telecommunications equipment, such as routers, switches, and modems, to implement complex communication protocols and functions.
  2. Industrial control systems: The device can be used in industrial control systems to implement custom logic and control functions, improving system performance and reliability.
  3. Automotive electronics: The XCV1000E-6BG560I can be used in automotive applications, such as engine control units and infotainment systems, to implement complex control algorithms and interfaces.
  4. Consumer electronics: The IC can be used in consumer electronics, such as smartphones, tablets, and smart home devices, to implement custom functions and improve overall system performance.
  5. Aerospace and defense: The XCV1000E-6BG560I can be used in aerospace and defense applications, such as radar systems and satellite communication equipment, to implement high-speed signal processing and control functions.

In summary, AMD's XCV1000E-6BG560I is a high-performance, versatile IC that offers a range of features and capabilities suitable for use in various applications. Its combination of programmable logic, on-chip memory, DSP capabilities, and high-speed I/O make it an ideal choice for implementing complex designs and functions in a wide range of industries.

FAQ

What package or case is XCV1000E-6BG560I available in?
XCV1000E-6BG560I is available in the 560-LBGA Exposed Pad, Metal package / case.
What is the mounting type of XCV1000E-6BG560I?
What is XCV1000E-6BG560I?
What voltage specification is listed for XCV1000E-6BG560I?
What operating temperature range does XCV1000E-6BG560I support?
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