AMD_XCV600-6FG676C
original

AMD
XCV600-6FG676C

696-XCV600-6FG676C
PDF Datasheet
IC FPGA 444 I/O 676FCBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
98304
Number of LABs/CLBs
3456
ECCN
3A991D
Number of I/O
444
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
676-FBGA (27x27)
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XCV600-6FG676C Description

The XCV600-6FG676C is a high-performance integrated circuit (IC) manufactured by Advanced Micro Devices (AMD). This IC is designed for use in a variety of applications, including industrial control systems, automotive electronics, and telecommunications equipment.

Description:

The XCV600-6FG676C is a 600 MHz, 6-layer flip-chip ball grid array (FCBGA) package. It features a high-speed, low-power design, making it well-suited for use in demanding applications that require both high performance and energy efficiency.

Features:

Some of the key features of the XCV600-6FG676C include:

  1. High-speed operation: With a clock speed of 600 MHz, the XCV600-6FG676C can handle complex tasks and data processing quickly and efficiently.
  2. Low power consumption: The IC is designed to minimize power usage, making it an ideal choice for applications where energy efficiency is a priority.
  3. 6-layer flip-chip ball grid array (FCBGA) package: This package provides a high level of integration and reliability, making it suitable for use in harsh environments and demanding applications.
  4. Robust performance: The XCV600-6FG676C is designed to deliver consistent and reliable performance, even in challenging conditions.
  5. Wide operating temperature range: The IC can operate in a wide range of temperatures, making it suitable for use in various environments.

Applications:

The XCV600-6FG676C is suitable for use in a variety of applications, including:

  1. Industrial control systems: The high-speed and low-power design of the IC make it well-suited for use in industrial control systems, where reliable and efficient performance is critical.
  2. Automotive electronics: The XCV600-6FG676C can be used in various automotive applications, such as infotainment systems, advanced driver assistance systems (ADAS), and engine control units (ECUs).
  3. Telecommunications equipment: The IC's high-speed and low-power capabilities make it an excellent choice for use in telecommunications equipment, such as base stations, routers, and switches.
  4. Networking equipment: The XCV600-6FG676C can be used in networking equipment, such as switches, routers, and firewalls, to provide high-speed data processing and efficient power usage.
  5. Consumer electronics: The IC can also be used in various consumer electronics, such as set-top boxes, gaming consoles, and smart home devices, to provide high-performance processing capabilities.

In summary, the AMD XCV600-6FG676C is a high-performance, low-power integrated circuit designed for use in a wide range of applications. Its features, such as high-speed operation, low power consumption, and robust performance, make it an excellent choice for demanding applications in various industries.

FAQ

What package or case is XCV600-6FG676C available in?
XCV600-6FG676C is available in the 676-BGA package / case.
What is the mounting type of XCV600-6FG676C?
What is XCV600-6FG676C?
Is XCV600-6FG676C currently in stock?
Are there related or alternative parts for XCV600-6FG676C?
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