AMD_XCVC1902-2LLEVSVA2197
original

AMD
XCVC1902-2LLEVSVA2197

777-XCVC1902-2LLEVSVA2197
IC VERSAL AICORE FPGA 2197BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
450MHz, 1.08GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
3A001A7B
Number of I/O
770
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XCVC1902-2LLEVSVA2197 Description

XCVC1902-2LLEVSVA2197 Description

The XCVC1902-2LLEVSVA2197 is a high-performance, Versal™ AI Core FPGA designed by AMD, offering a blend of advanced processing capabilities and extensive connectivity options. This embedded IC chip is part of the Versal™ AI Core series, known for its superior performance and flexibility. The device features a dual-core architecture combining a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA) with a clock speed of 450MHz and 1.08GHz, ensuring rapid processing and efficient task execution. It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for various industrial and commercial applications. The XCVC1902-2LLEVSVA2197 is equipped with 256KB of RAM, providing ample memory for complex computations and data storage. It also supports Error Correction Code (ECCN) 3A001A7B, ensuring data integrity and reliability. With 770 I/O ports, this FPGA offers extensive connectivity options, including DDR, DMA, and PCIe, facilitating seamless integration with other components and systems. The device is packaged in a tray format and is RoHS3 compliant, adhering to stringent environmental standards. It has a Moisture Sensitivity Level (MSL) of 4 (72 Hours), ensuring durability and reliability in various environmental conditions.

XCVC1902-2LLEVSVA2197 Features

The XCVC1902-2LLEVSVA2197 stands out with its unique combination of features that provide significant advantages over similar models. Key features include:

  • Dual-Core Architecture: Combining MPU and FPGA capabilities, this device offers versatile processing options suitable for both general-purpose computing and specialized tasks.
  • High-Speed Processing: With clock speeds of 450MHz and 1.08GHz, the XCVC1902-2LLEVSVA2197 ensures rapid execution of complex algorithms and data processing tasks.
  • Extensive Connectivity: The device supports a wide range of peripherals, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for various applications.
  • Robust Memory and I/O: Equipped with 256KB of RAM and 770 I/O ports, the XCVC1902-2LLEVSVA2197 can handle large datasets and complex operations efficiently.
  • Environmental Compliance: The device is RoHS3 compliant and has an MSL of 4 (72 Hours), ensuring it meets environmental and durability standards.
  • Active Product Status: The XCVC1902-2LLEVSVA2197 is an active product, ensuring continued support and availability for ongoing projects and future developments.

XCVC1902-2LLEVSVA2197 Applications

The XCVC1902-2LLEVSVA2197 is ideal for a variety of applications due to its high performance, extensive connectivity, and robust features. Key applications include:

  • Industrial Automation: The device's high-speed processing and extensive connectivity options make it suitable for controlling complex machinery and systems in industrial environments.
  • Telecommunications: The XCVC1902-2LLEVSVA2197 can be used in networking equipment, providing efficient data processing and communication capabilities.
  • Automotive Systems: The device's robustness and compliance with environmental standards make it suitable for automotive applications, including advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
  • Medical Devices: The high reliability and data integrity features of the XCVC1902-2LLEVSVA2197 make it ideal for medical imaging and diagnostic equipment.
  • Consumer Electronics: The device can be used in high-performance consumer electronics, such as smart TVs and gaming consoles, providing advanced processing capabilities and connectivity options.

Conclusion of XCVC1902-2LLEVSVA2197

The XCVC1902-2LLEVSVA2197 is a versatile and high-performance Versal™ AI Core FPGA that offers significant advantages in terms of processing power, connectivity, and environmental compliance. Its dual-core architecture, extensive I/O options, and robust memory capabilities make it suitable for a wide range of applications, from industrial automation to consumer electronics. The device's active product status ensures continued support and availability, making it a reliable choice for both current and future projects. With its unique combination of features and performance benefits, the XCVC1902-2LLEVSVA2197 stands out as a superior option in the embedded IC chip market.

FAQ

What package or case is XCVC1902-2LLEVSVA2197 available in?
XCVC1902-2LLEVSVA2197 is available in the 2197-BFBGA, FCBGA package / case.
What is XCVC1902-2LLEVSVA2197?
Are there related or alternative parts for XCVC1902-2LLEVSVA2197?
What operating temperature range does XCVC1902-2LLEVSVA2197 support?
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