AMD Tariff Inquiry

XCZU11EG-2FFVC1156I

XCZU11EG-2FFVC1156I Description

The XCZU11EG-2FFVC1156I from AMD's Zynq® UltraScale+™ MPSoC EG series is a high-performance System-on-Chip (SoC) integrating a multi-core ARM® Cortex®-A53 processor with UltraScale+™ FPGA fabric, delivering 653K+ logic cells for flexible hardware acceleration. This device operates at 533MHz, 600MHz, or 1.3GHz, offering scalable performance for compute-intensive applications. Packaged in a 1156-ball FCBGA, it features 360 I/O pins and 256KB RAM, supporting high-speed interfacing and real-time processing.

XCZU11EG-2FFVC1156I Features

• Heterogeneous Architecture: Combines MCU + FPGA for parallel processing and hardware customization.
• Rich Connectivity: Includes CANbus, Ethernet, USB OTG, SPI, I2C, UART/USART, and EBI/EMI for versatile system integration.
• High-Speed Processing: Supports 1.3GHz CPU clock and UltraScale+™ FPGA for low-latency acceleration.
• Robust Peripherals: Integrated DMA and WDT enhance reliability in critical applications.
• Compliance: ROHS3, REACH Unaffected, and ECCN 5A002A4 XIL certified for industrial use.
• Extended Temperature Support: -40°C to +100°C operation (implied by "I" suffix).

XCZU11EG-2FFVC1156I Applications

• 5G & Wireless Infrastructure: Leverages FPGA programmability for baseband processing.
• Automotive ADAS: Combines real-time MCU control with FPGA-based sensor fusion.
• Industrial Automation: High I/O count enables multi-protocol machine control.
• Aerospace & Defense: Secure processing with military-grade ECCN compliance.
• Medical Imaging: FPGA acceleration for high-throughput data processing.

Conclusion of XCZU11EG-2FFVC1156I

The XCZU11EG-2FFVC1156I stands out for its dual ARM-FPGA architecture, high-speed interfaces, and industrial-grade robustness. Ideal for edge computing, vision processing, and high-reliability systems, it outperforms conventional SoCs with its scalable logic density and low-power UltraScale+™ technology. Its 1156-FCBGA package ensures compact integration, making it a top choice for next-gen embedded designs.