AMD Tariff Inquiry

XCZU11EG-2FFVF1517I

XCZU11EG-2FFVF1517I Description

The XCZU11EG-2FFVF1517I is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG series, combining a quad-core ARM® Cortex®-A53 processor (operating at 533MHz, 600MHz, or 1.3GHz) with a UltraScale+™ FPGA fabric featuring 653K+ logic cells. This device integrates 256KB RAM, 464 I/O pins, and advanced peripherals, making it ideal for compute-intensive embedded applications. Packaged in a 1517-ball FCBGA, it supports RoHS3 compliance and REACH unaffected environmental standards, ensuring reliability in industrial and commercial deployments.

XCZU11EG-2FFVF1517I Features

• Heterogeneous Architecture: Combines MCU (ARM Cortex-A53) and FPGA (UltraScale+™) for flexible hardware-software co-design.
• High-Speed Connectivity: Includes CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, and MMC/SD/SDIO interfaces.
• Robust Peripherals: Features DMA for efficient data transfer and WDT (Watchdog Timer) for system reliability.
• Scalable Performance: Supports dynamic frequency scaling (up to 1.3GHz) for power-sensitive applications.
• Industrial-Grade: MSL4 (72-hour moisture sensitivity) and ECCN 5A002A4 XIL compliance for export-controlled environments.

XCZU11EG-2FFVF1517I Applications

• Embedded Vision: Real-time image processing in ADAS, medical imaging, and surveillance systems.
• Industrial Automation: PLC controllers, motor control, and robotics leveraging FPGA programmability.
• Communications: 5G infrastructure, SDR (Software-Defined Radio), and high-speed data acquisition.
• Aerospace & Defense: Radar, avionics, and secure processing with low-latency FPGA acceleration.

Conclusion of XCZU11EG-2FFVF1517I

The XCZU11EG-2FFVF1517I stands out for its dual-core architecture, high logic density, and versatile I/O, making it superior to conventional SoCs in performance-per-watt and design flexibility. Its industrial certifications and broad connectivity suit mission-critical applications where reliability and real-time processing are paramount. Ideal for engineers seeking a scalable, future-proof solution for AI, edge computing, and high-speed embedded systems.