AMD_XCZU11EG-3FFVB1517E
original

AMD
XCZU11EG-3FFVB1517E

777-XCZU11EG-3FFVB1517E
IC SOC CORTEX-A53 1517FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
600MHz, 667MHz, 1.5GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
488
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XCZU11EG-3FFVB1517E Description

XCZU11EG-3FFVB1517E Description

The XCZU11EG-3FFVB1517E is a high-performance System on Chip (SoC) developed by AMD, belonging to the Zynq® UltraScale+™ MPSoC EG series. This IC SoC Cortex-A53 1517FCBGA is designed to deliver exceptional processing capabilities and flexibility, making it ideal for a wide range of demanding applications. It features a powerful architecture combining an MCU and FPGA, with a RAM size of 256KB. The device supports multiple operating speeds, including 600MHz, 667MHz, and 1.5GHz, ensuring robust performance across various use cases. It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for both standard and rugged environments. The XCZU11EG-3FFVB1517E is packaged in a tray format and has a moisture sensitivity level (MSL) of 4 (72 Hours), ensuring durability during handling and storage.

XCZU11EG-3FFVB1517E Features

The XCZU11EG-3FFVB1517E boasts several unique features that set it apart from similar models in the market. It integrates 653K+ logic cells, providing extensive programmability and customization options. The device supports a wide array of peripherals, including DMA and WDT, enhancing its versatility. Connectivity options are extensive, featuring CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for complex systems requiring multiple communication protocols. With 488 I/Os, this SoC can interface with numerous external devices, ensuring seamless integration into diverse systems. The XCZU11EG-3FFVB1517E is also REACH unaffected and RoHS3 compliant, adhering to stringent environmental and safety standards.

XCZU11EG-3FFVB1517E Applications

The XCZU11EG-3FFVB1517E is ideal for applications requiring high computational power and flexibility. Its combination of an MCU and FPGA architecture makes it suitable for embedded systems, industrial automation, and advanced networking solutions. The device's extensive connectivity options and large number of I/Os make it perfect for IoT gateways, smart factories, and complex control systems. Its ability to operate within a wide temperature range ensures reliability in harsh environments, making it a top choice for aerospace, defense, and automotive industries. The XCZU11EG-3FFVB1517E's programmable logic cells allow for custom hardware acceleration, enhancing performance in data-intensive applications such as machine learning and real-time analytics.

Conclusion of XCZU11EG-3FFVB1517E

The XCZU11EG-3FFVB1517E is a versatile and powerful SoC that offers a unique blend of processing capabilities and flexibility. Its robust architecture, extensive connectivity options, and wide operating temperature range make it an ideal choice for a variety of demanding applications. With its active product status and compliance with environmental and safety standards, the XCZU11EG-3FFVB1517E is a reliable and future-proof solution for modern electronic systems. Its unique features and advantages over similar models ensure that it stands out in the competitive electronics market, providing users with a high-performance and reliable option for their next-generation projects.

FAQ

What package or case is XCZU11EG-3FFVB1517E available in?
XCZU11EG-3FFVB1517E is available in the 1517-BBGA, FCBGA package / case.
What is the standard lead time for XCZU11EG-3FFVB1517E?
What operating temperature range does XCZU11EG-3FFVB1517E support?
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