AMD_XCZU11EG-L1FFVC1760I
original

AMD
XCZU11EG-L1FFVC1760I

777-XCZU11EG-L1FFVC1760I
IC SOC CORTEX-A53 1760FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
500MHz, 600MHz, 1.2GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
512
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XCZU11EG-L1FFVC1760I Description

XCZU11EG-L1FFVC1760I Description

The XCZU11EG-L1FFVC1760I is a high-performance System on Chip (SoC) from AMD, featuring the Zynq® UltraScale+™ MPSoC EG series. This IC SOC CORTEX-A53 1760FCBGA is designed to deliver exceptional performance and flexibility, making it ideal for a wide range of applications. The device integrates a powerful ARM Cortex-A53 processor with a high-density FPGA fabric, providing a seamless blend of programmable logic and processing capabilities.

XCZU11EG-L1FFVC1760I Features

  • Architecture: The XCZU11EG-L1FFVC1760I combines a multi-core ARM Cortex-A53 processor with a high-performance FPGA fabric, offering a versatile architecture that supports both MCU and FPGA functionalities.
  • Speed: The SoC operates at speeds of up to 1.2GHz, with additional options at 500MHz and 600MHz, ensuring robust performance for demanding applications.
  • RAM Size: Equipped with 256KB of RAM, this SoC can efficiently handle complex tasks and data processing.
  • Connectivity: The device supports a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for diverse communication needs.
  • Peripherals: Features such as DMA and WDT are integrated, enhancing the SoC's functionality and reliability.
  • I/O Count: With 512 I/O pins, the XCZU11EG-L1FFVC1760I offers extensive connectivity and interfacing capabilities.
  • ECCN: Classified under ECCN 5A002A4 XIL, this SoC complies with international export regulations.
  • Compliance: The device is REACH unaffected and RoHS3 compliant, ensuring environmental and regulatory standards are met.
  • Packaging: Available in a Tray package, the XCZU11EG-L1FFVC1760I is designed for efficient handling and assembly.
  • Moisture Sensitivity Level (MSL): With an MSL rating of 4 (72 Hours), the SoC is suitable for various manufacturing environments.

XCZU11EG-L1FFVC1760I Applications

The XCZU11EG-L1FFVC1760I is ideal for applications requiring high computational power and flexible programmability. Key use cases include:

  • Embedded Systems: The combination of ARM Cortex-A53 and FPGA fabric makes it suitable for embedded systems requiring real-time processing and custom logic.
  • Industrial Automation: The extensive I/O capabilities and connectivity options make it ideal for industrial control systems and IoT gateways.
  • Communication Infrastructure: The SoC's high-speed processing and connectivity features are well-suited for networking and communication applications.
  • Automotive: The robust performance and reliability make it a strong candidate for automotive applications, including advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI).

Conclusion of XCZU11EG-L1FFVC1760I

The XCZU11EG-L1FFVC1760I stands out as a versatile and high-performance SoC, offering a unique blend of processing power and programmable logic. Its extensive connectivity options, robust I/O capabilities, and compliance with industry standards make it a reliable choice for a variety of applications. Whether used in embedded systems, industrial automation, or communication infrastructure, the XCZU11EG-L1FFVC1760I provides the flexibility and performance needed to meet the demands of modern electronics.

FAQ

What operating temperature range does XCZU11EG-L1FFVC1760I support?
XCZU11EG-L1FFVC1760I has an operating temperature range of -40°C ~ 100°C (TJ).
Are there related or alternative parts for XCZU11EG-L1FFVC1760I?
Is XCZU11EG-L1FFVC1760I currently in stock?
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