AMD_XCZU15EG-3FFVB1156E
original

AMD
XCZU15EG-3FFVB1156E

777-XCZU15EG-3FFVB1156E
IC SOC CORTEX-A53 1156FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
600MHz, 667MHz, 1.5GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
328
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XCZU15EG-3FFVB1156E Description

XCZU15EG-3FFVB1156E Description

The XCZU15EG-3FFVB1156E is a high-performance System on Chip (SoC) developed by AMD, part of the Zynq® UltraScale+™ MPSoC EG series. This IC SOC CORTEX-A53 1156FCBGA is designed for demanding applications requiring advanced processing capabilities and extensive connectivity options. It integrates a powerful MCU and FPGA architecture, offering a versatile platform for various industrial and embedded systems.

XCZU15EG-3FFVB1156E Features

  • High-Speed Performance: The XCZU15EG-3FFVB1156E operates at speeds of 600MHz, 667MHz, and 1.5GHz, ensuring rapid processing and efficient data handling.
  • Robust Operating Temperature Range: With an operating temperature range of 0°C to 100°C (TJ), this SoC is suitable for applications in diverse environmental conditions.
  • Advanced Architecture: Combining MCU and FPGA capabilities, this SoC provides both programmable logic and embedded processing units, offering flexibility and scalability.
  • Substantial RAM Size: Equipped with 256KB of RAM, the XCZU15EG-3FFVB1156E can handle complex tasks and large datasets efficiently.
  • Extensive Connectivity Options: The SoC supports a wide range of connectivity protocols, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it ideal for applications requiring multiple interfaces.
  • Peripheral Support: Features like DMA and WDT enhance its functionality and reliability.
  • Compliance and Standards: The XCZU15EG-3FFVB1156E is REACH Unaffected and ROHS3 Compliant, ensuring it meets stringent environmental and safety standards.
  • Packaging and Sensitivity: Available in a Tray package with a Moisture Sensitivity Level (MSL) of 4 (72 Hours), it is designed for reliable handling and storage.

XCZU15EG-3FFVB1156E Applications

The XCZU15EG-3FFVB1156E is ideal for a variety of applications due to its versatile architecture and extensive feature set. Key applications include:

  • Industrial Automation: Its robust performance and connectivity options make it suitable for controlling complex machinery and systems.
  • Embedded Systems: The combination of MCU and FPGA capabilities allows for efficient processing and programmable logic, ideal for embedded applications.
  • Networking and Communication: With support for Ethernet and USB OTG, this SoC is well-suited for networking devices and communication systems.
  • Automotive and Transportation: The wide operating temperature range and extensive connectivity options make it a reliable choice for automotive applications.
  • Medical Devices: Its high performance and reliability are beneficial for medical equipment requiring precise control and data processing.

Conclusion of XCZU15EG-3FFVB1156E

The XCZU15EG-3FFVB1156E stands out in the market due to its advanced technical specifications and versatile capabilities. Its high-speed performance, extensive connectivity options, and robust operating temperature range make it a reliable choice for a variety of applications. The integration of MCU and FPGA architecture provides both flexibility and scalability, ensuring it can handle complex tasks and large datasets efficiently. Whether used in industrial automation, embedded systems, or automotive applications, the XCZU15EG-3FFVB1156E offers a powerful and reliable solution, making it a standout choice in the electronics industry.

FAQ

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The standard lead time for XCZU15EG-3FFVB1156E is 16 Weeks.
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