AMD
XCZU19EG-1FFVD1760E

777-XCZU19EG-1FFVD1760E
IC SOC CORTEX-A53 1760FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
500MHz, 600MHz, 1.2GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
308
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XCZU19EG-1FFVD1760E Description

XCZU19EG-1FFVD1760E Description

The XCZU19EG-1FFVD1760E is a high-performance System on Chip (SoC) developed by AMD, featuring a Zynq® UltraScale+™ MPSoC architecture. This SoC integrates a powerful ARM Cortex-A53 processor with a robust FPGA fabric, providing a versatile platform for a wide range of applications. The device is housed in a 1760FCBGA package and is designed to operate within an industrial temperature range of 0°C to 100°C (TJ). It offers a comprehensive set of peripherals and connectivity options, including CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, and more.

XCZU19EG-1FFVD1760E Features

  • Dual Architecture: Combines an ARM Cortex-A53 MCU with a high-density FPGA, providing both programmable logic and processing capabilities.
  • High-Speed Processing: Supports multiple clock speeds, including 500MHz, 600MHz, and up to 1.2GHz, ensuring efficient performance for demanding applications.
  • Robust Memory: Equipped with 256KB of RAM, which is crucial for handling complex tasks and data-intensive operations.
  • Extensive I/O Capabilities: Features 308 I/O pins, allowing for extensive connectivity and integration with various peripherals.
  • Advanced Peripherals: Includes Direct Memory Access (DMA) and Watchdog Timer (WDT) for enhanced system management and reliability.
  • Compliance and Standards: Complies with REACH and RoHS3 standards, ensuring environmental sustainability and regulatory adherence.
  • Packaging and Handling: Available in a Tray package with a Moisture Sensitivity Level (MSL) of 4 (72 Hours), suitable for industrial handling and storage.

XCZU19EG-1FFVD1760E Applications

The XCZU19EG-1FFVD1760E is ideal for applications requiring high computational power and flexibility. Its dual-architecture design makes it suitable for:

  • Embedded Systems: Ideal for developing complex embedded systems that require both high-speed processing and programmable logic.
  • Industrial Automation: Can be used in industrial control systems, where real-time processing and robust I/O capabilities are essential.
  • Communication Systems: Suitable for applications involving high-speed data transmission and processing, such as Ethernet and CANbus-based systems.
  • Consumer Electronics: Can be integrated into advanced consumer electronics for enhanced performance and functionality.
  • Automotive Systems: Provides the necessary processing power and connectivity for advanced automotive electronics, including infotainment and control systems.

Conclusion of XCZU19EG-1FFVD1760E

The XCZU19EG-1FFVD1760E stands out as a versatile and powerful SoC, offering a unique combination of high-speed processing and programmable logic. Its extensive I/O capabilities and compliance with industry standards make it a reliable choice for a variety of applications. Whether used in industrial automation, communication systems, or consumer electronics, the XCZU19EG-1FFVD1760E delivers exceptional performance and flexibility, making it a standout solution in the electronics industry.

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