AMD_XCZU19EG-3FFVB1517E
original

AMD
XCZU19EG-3FFVB1517E

777-XCZU19EG-3FFVB1517E
IC SOC CORTEX-A53 1517FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
600MHz, 667MHz, 1.5GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
644
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XCZU19EG-3FFVB1517E Description

XCZU19EG-3FFVB1517E Description

The XCZU19EG-3FFVB1517E is a high-performance System on Chip (SoC) from AMD, designed to deliver exceptional processing capabilities and flexibility. This SoC is part of the Zynq® UltraScale+™ MPSoC EG series, known for its advanced architecture and robust feature set. It integrates a Cortex-A53 processor with an FPGA fabric, providing a powerful combination of processing power and programmable logic. The device is housed in a 1517FCBGA package and is suitable for a wide range of applications requiring high performance and reliability.

XCZU19EG-3FFVB1517E Features

  • Architecture: The XCZU19EG-3FFVB1517E features a dual-architecture design, combining an MCU with an FPGA. This hybrid approach allows for both high-speed processing and flexible programmability, making it ideal for complex applications.
  • Speed: The SoC operates at speeds of up to 1.5GHz, with additional options at 600MHz and 667MHz, ensuring it can handle demanding computational tasks efficiently.
  • Operating Temperature: With an operating temperature range of 0°C to 100°C (TJ), the XCZU19EG-3FFVB1517E is suitable for use in a variety of environments, including those with extreme temperature variations.
  • RAM Size: The device includes 256KB of RAM, providing ample memory for data storage and processing.
  • I/O Capabilities: The XCZU19EG-3FFVB1517E boasts 644 I/O pins, offering extensive connectivity options for interfacing with other components and systems.
  • Peripherals: It supports a wide range of peripherals, including DMA, WDT, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for various applications.
  • Compliance and Status: The SoC is REACH unaffected and RoHS3 compliant, ensuring it meets stringent environmental and safety standards. It also has an ECCN classification of 5A002A4 XIL, indicating its compliance with export regulations.
  • Moisture Sensitivity Level: With an MSL of 4 (72 Hours), the XCZU19EG-3FFVB1517E is designed to withstand moderate moisture exposure, making it suitable for industrial and outdoor applications.

XCZU19EG-3FFVB1517E Applications

The XCZU19EG-3FFVB1517E is ideal for applications that require high performance, flexibility, and reliability. Some specific use cases include:

  • Advanced Industrial Control Systems: The combination of high-speed processing and programmable logic makes it suitable for complex automation and control systems.
  • Telecommunications: The extensive I/O capabilities and support for Ethernet and USB OTG make it ideal for networking and communication applications.
  • Automotive Systems: The wide operating temperature range and robust design make it suitable for automotive applications, including advanced driver-assistance systems (ADAS) and infotainment systems.
  • Medical Devices: The SoC's high performance and reliability make it suitable for medical imaging and diagnostic equipment.
  • Aerospace and Defense: The XCZU19EG-3FFVB1517E's compliance with stringent environmental and safety standards makes it ideal for aerospace and defense applications.

Conclusion of XCZU19EG-3FFVB1517E

The XCZU19EG-3FFVB1517E is a versatile and powerful SoC that offers a unique combination of high-speed processing and programmable logic. Its extensive I/O capabilities, wide operating temperature range, and compliance with environmental and safety standards make it suitable for a wide range of applications. Whether used in industrial control systems, telecommunications, automotive, medical devices, or aerospace and defense, the XCZU19EG-3FFVB1517E provides reliable performance and flexibility, making it a standout choice in the electronics industry.

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