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XCZU19EG-3FFVD1760E

XCZU19EG-3FFVD1760E Description

The XCZU19EG-3FFVD1760E is a high-performance System on Chip (SoC) designed by AMD, belonging to the Zynq® UltraScale+™ MPSoC EG series. This advanced SoC integrates a powerful Zynq® UltraScale+™ FPGA with 1143K+ Logic Cells, providing exceptional computing capabilities. It operates at speeds ranging from 600MHz to 1.5GHz and features a robust architecture that combines both MCU and FPGA elements. With 256KB of RAM, 308 I/O, and support for DMA and WDT peripherals, this SoC is equipped to handle complex tasks efficiently.

XCZU19EG-3FFVD1760E Features

• Speed: The XCZU19EG-3FFVD1760E boasts a versatile speed range, from 600MHz to 667MHz and up to 1.5GHz, catering to various performance needs.
• Operating Temperature: Designed to function in extreme conditions, it operates within a wide temperature range of 0°C to 100°C (TJ).
• Architecture: The SoC's architecture is a synergy of MCU and FPGA, offering both control and flexibility.
• RAM Size: With 256KB of RAM, it provides ample memory for data processing.
• ECCN: Classified under 5A002A4 XIL, ensuring compliance with export control regulations.
• Number of I/O: Features 308 I/O, enhancing connectivity options.
• Peripherals: Includes DMA for efficient data transfer and WDT for system reliability.
• Product Status: Active, indicating ongoing support and availability.
• Series: Part of the Zynq® UltraScale+™ MPSoC EG series, known for high-end performance.
• REACH Status: REACH Unaffected, complying with European chemical regulations.
• Connectivity: Supports a wide range of interfaces including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
• HTSUS: Classified under 8542.39.0001 for customs purposes.
• Package: Supplied in a Tray package for easy handling and storage.
• RoHS Status: Compliant with ROHS3 standards, ensuring environmental responsibility.
• Primary Attributes: The SoC is equipped with a Zynq®UltraScale+™ FPGA and a substantial 1143K+ Logic Cells, making it suitable for complex applications.
• Base Product Number: XCZU19, indicating its base model within the series.
• Moisture Sensitivity Level (MSL): Rated at 4 (72 Hours), ensuring reliability in various environmental conditions.

XCZU19EG-3FFVD1760E Applications

The XCZU19EG-3FFVD1760E is ideal for applications demanding high processing power, extensive I/O, and robust connectivity. It is particularly suited for:

• High-End Networking Equipment: Due to its multiple communication interfaces and high-speed processing.
• Industrial Automation: Leveraging its robust architecture and wide operating temperature range.
• Embedded Systems: Benefiting from its FPGA capabilities for custom logic implementations.
• Automotive Infotainment Systems: With its ability to handle complex data processing and multiple communication protocols.

Conclusion of XCZU19EG-3FFVD1760E

The XCZU19EG-3FFVD1760E stands out as a versatile and powerful SoC, offering a unique blend of processing speed, memory, and I/O capabilities. Its compliance with various standards and its wide range of connectivity options make it a top choice for demanding applications across different industries. AMD's commitment to quality and compliance further solidifies the XCZU19EG-3FFVD1760E as a reliable solution for complex system-on-chip requirements.