AMD Tariff Inquiry

XCZU3CG-2SFVC784I

XCZU3CG-2SFVC784I Description

The XCZU3CG-2SFVC784I from AMD's Zynq® UltraScale+™ MPSoC CG series is a high-performance System-on-Chip (SoC) integrating a dual-core ARM® Cortex®-A53 MPCore™ (up to 1.3GHz) and UltraScale+™ FPGA fabric (154K+ logic cells). Designed for embedded applications requiring real-time processing and hardware acceleration, it combines MCU and FPGA architectures in a single 784-ball FCBGA package. With 256KB RAM, robust I/O capabilities (252 pins), and advanced connectivity options (CANbus, Ethernet, USB OTG, etc.), it delivers exceptional flexibility for complex designs. Compliant with ROHS3 and REACH, it suits industrial, automotive, and aerospace applications.

XCZU3CG-2SFVC784I Features

• Dual Processing Domains: ARM Cortex-A53 (up to 1.3GHz) + FPGA fabric for parallel compute and hardware acceleration.
• High I/O Density: 252 I/O pins supporting versatile interfacing (Ethernet, SPI, UART, etc.).
• Rich Peripherals: Includes DMA, WDT, and multi-protocol support (CANbus, USB OTG, SDIO).
• Low Latency: Integrated 256KB RAM for efficient data handling.
• Industrial Robustness: MSL 4 (72-hour moisture resistance) and ECCN 5A002A4 XIL compliance.
• Power Efficiency: Optimized for low-power, high-performance edge computing.

XCZU3CG-2SFVC784I Applications

• Industrial Automation: Real-time control systems with FPGA-based signal processing.
• Automotive ADAS: Sensor fusion and vision processing leveraging dual-core + FPGA synergy.
• Aerospace & Defense: Secure, high-reliability embedded systems with MIL-grade robustness.
• Communications: High-speed data routing (Ethernet, USB OTG) and protocol bridging.
• Medical Devices: Low-latency imaging and diagnostics with hardware-accelerated algorithms.

Conclusion of XCZU3CG-2SFVC784I

The XCZU3CG-2SFVC784I stands out for its heterogeneous compute architecture, combining ARM cores and FPGA logic for scalable, power-efficient designs. Its extensive I/O, industrial certifications, and broad connectivity make it ideal for applications demanding real-time processing, hardware flexibility, and reliability. A top choice for engineers developing next-gen embedded systems in harsh or performance-critical environments.