AMD_XCZU4CG-1FBVB900E

AMD
XCZU4CG-1FBVB900E  
System On Chip (SoC)

AMD
XCZU4CG-1FBVB900E
777-XCZU4CG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA
In Stock : 407

Not available to buy online? Want the lower wholesale price? Please Send RFQ to get best price, we will respond immediately

QUICK RFQ
ADD TO RFQ LIST
ersa FreeSample ersa flow
ISO9001
Quality Policy
ISO45001
ISO14001

XCZU4CG-1FBVB900E Description

Model XCZU4CG-1FBVB900E is a high-performance integrated circuit (IC) manufactured by AMD. This IC is designed to provide advanced functionality and high performance in a variety of applications.

Description:

The XCZU4CG-1FBVB900E is a complex programmable logic device (CPLD) that is built using advanced CMOS technology. It features a high-density architecture that allows for the integration of a large number of gates and other digital logic elements in a single package. The device is designed to be highly configurable, allowing users to customize its functionality to meet the specific requirements of their applications.

Features:

Some of the key features of the XCZU4CG-1FBVB900E include:

  1. High-density architecture: The XCZU4CG-1FBVB900E features a high-density architecture that allows for the integration of a large number of gates and other digital logic elements in a single package.
  2. Advanced CMOS technology: The device is built using advanced CMOS technology, which provides high performance and low power consumption.
  3. Configurability: The XCZU4CG-1FBVB900E is highly configurable, allowing users to customize its functionality to meet the specific requirements of their applications.
  4. High-speed performance: The device is designed to provide high-speed performance, making it suitable for a wide range of applications that require fast processing.
  5. Low power consumption: The XCZU4CG-1FBVB900E is designed to consume low power, making it an energy-efficient solution for a variety of applications.

Applications:

The XCZU4CG-1FBVB900E is suitable for a wide range of applications that require high performance and configurability. Some of the potential applications for this device include:

  1. Digital signal processing: The XCZU4CG-1FBVB900E can be used in digital signal processing applications, where it can be used to implement complex algorithms and perform high-speed data processing.
  2. Telecommunications: The device can be used in telecommunications applications, where it can be used to implement complex communication protocols and perform high-speed data transmission.
  3. Industrial control: The XCZU4CG-1FBVB900E can be used in industrial control applications, where it can be used to implement complex control algorithms and perform real-time data processing.
  4. Automotive: The device can be used in automotive applications, where it can be used to implement complex control systems and perform real-time data processing.
  5. Consumer electronics: The XCZU4CG-1FBVB900E can be used in consumer electronics applications, where it can be used to implement complex features and provide high-performance processing.

Overall, the XCZU4CG-1FBVB900E is a high-performance, configurable IC that is suitable for a wide range of applications that require advanced functionality and high performance. Its high-density architecture, advanced CMOS technology, and low power consumption make it an ideal solution for a variety of applications.

Tech Specifications

Core Processor
Speed
Operating Temperature
Architecture
Flash Size
RAM Size
ECCN
Number of I/O
Peripherals
Product Status
Supplier Device Package
Series
Package / Case
REACH Status
Mfr
Connectivity
HTSUS
Package
RoHS Status
Primary Attributes
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Unit Weight
Number of Logic Elements
Number of Logic Array Blocks - LABs
Distributed RAM
L1 Cache Instruction Memory
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Minimum Operating Temperature
Tradename
L1 Cache Data Memory
Embedded Block RAM - EBR
Moisture Sensitive
Operating Supply Voltage
Maximum Clock Frequency
Maximum Operating Temperature
USHTS
Number of Cores
Number of Transceivers
Core

XCZU4CG-1FBVB900E Documents

Download datasheets and manufacturer documentation for XCZU4CG-1FBVB900E

Ersa Zynq UltraScale+ MPSoC Overview      
Ersa Xilinx REACH211 Cert       Xiliinx RoHS Cert      

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service