AMD_XCZU55DR-L1FFVE1156I
original

AMD
XCZU55DR-L1FFVE1156I

777-XCZU55DR-L1FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
500MHz, 1.2GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
-
Number of I/O
-
Peripherals
DDR, DMA, PCIe, WDT
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XCZU55DR-L1FFVE1156I Description

XCZU55DR-L1FFVE1156I Description

The XCZU55DR-L1FFVE1156I is an advanced Embedded IC Chip from AMD, part of the Zynq® UltraScale+™ RFSoC DR series. This high-performance chip integrates a multi-processor unit (MPU) and field-programmable gate array (FPGA) architecture, offering versatile processing capabilities. It supports a wide range of peripherals, including DDR, DMA, PCIe, and WDT, making it suitable for complex embedded systems. The chip operates at speeds of 500MHz and 1.2GHz, ensuring robust performance for demanding applications. Packaged in a tray format, it is ROHS3 compliant and has a moisture sensitivity level (MSL) of 4 (72 Hours), making it suitable for various industrial environments.

XCZU55DR-L1FFVE1156I Features

  • Dual-Speed Performance: Capable of operating at 500MHz and 1.2GHz, the XCZU55DR-L1FFVE1156I offers flexibility in performance optimization for different tasks.
  • Integrated Architecture: Combines MPU and FPGA functionalities, providing a powerful platform for both general-purpose processing and custom logic implementation.
  • Rich Peripheral Support: Features DDR, DMA, PCIe, and WDT peripherals, enabling seamless integration with various hardware components.
  • Connectivity Options: Equipped with CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces, facilitating extensive connectivity options.
  • Compliance and Reliability: ROHS3 compliant and rated at MSL 4 (72 Hours), ensuring environmental safety and reliability in moisture-sensitive applications.
  • Active Product Status: Continuously supported by AMD, ensuring long-term availability and technical support.

XCZU55DR-L1FFVE1156I Applications

The XCZU55DR-L1FFVE1156I is ideal for a variety of high-performance embedded applications, including:

  • Communications: Ideal for 5G and other advanced wireless communication systems, where high-speed processing and low latency are critical.
  • Industrial Automation: Suitable for complex control systems that require real-time processing and extensive peripheral integration.
  • Aerospace and Defense: Meets the stringent requirements of aerospace and defense applications, offering reliable performance and robust connectivity.
  • Medical Devices: Can be used in medical imaging and diagnostic equipment, where high-speed data processing and precision are essential.
  • Automotive: Enhances advanced driver-assistance systems (ADAS) and autonomous driving technologies with its powerful processing capabilities.

Conclusion of XCZU55DR-L1FFVE1156I

The XCZU55DR-L1FFVE1156I stands out as a versatile and high-performance solution within the Zynq® UltraScale+™ RFSoC DR series. Its dual-speed operation, integrated MPU and FPGA architecture, and extensive peripheral support make it a powerful choice for a wide range of embedded applications. The chip's compliance with ROHS3 standards and its MSL 4 rating ensure its suitability for various industrial environments. AMD's active support further guarantees long-term reliability and technical assistance. Whether for communications, industrial automation, aerospace, defense, medical devices, or automotive applications, the XCZU55DR-L1FFVE1156I offers a robust and flexible platform for developers and engineers.

FAQ

What package or case is XCZU55DR-L1FFVE1156I available in?
XCZU55DR-L1FFVE1156I is available in the 1156-BBGA, FCBGA package / case.
Are there related or alternative parts for XCZU55DR-L1FFVE1156I?
Does XCZU55DR-L1FFVE1156I have quantity-based pricing?
What is XCZU55DR-L1FFVE1156I?
What operating temperature range does XCZU55DR-L1FFVE1156I support?
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