AMD_XCZU57DR-2FSVE1156I
original

AMD
XCZU57DR-2FSVE1156I

777-XCZU57DR-2FSVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
20 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
533MHz, 1.3GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
-
Number of I/O
-
Peripherals
DDR, DMA, PCIe, WDT
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XCZU57DR-2FSVE1156I Description

XCZU57DR-2FSVE1156I Description

The XCZU57DR-2FSVE1156I is a high-performance embedded IC chip from the Zynq® UltraScale+™ RFSoC DR series, manufactured by AMD. This IC integrates a powerful MPU and FPGA architecture, offering a versatile platform for a wide range of applications. With a speed range of 533MHz to 1.3GHz, it provides robust processing capabilities. The device supports various peripherals, including DDR, DMA, PCIe, and WDT, and offers extensive connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The XCZU57DR-2FSVE1156I is packaged in a tray and is ROHS3 compliant, ensuring environmental sustainability. It has a moisture sensitivity level (MSL) of 4 (72 hours), making it suitable for various industrial environments.

XCZU57DR-2FSVE1156I Features

  • High-Speed Processing: The XCZU57DR-2FSVE1156I operates at speeds up to 1.3GHz, providing fast and efficient processing capabilities.
  • Dual Architecture: Combining MPU and FPGA functionalities, this IC offers flexibility in both programmable logic and processing tasks.
  • Rich Peripheral Support: Equipped with DDR, DMA, PCIe, and WDT, it supports complex system designs with ease.
  • Extensive Connectivity: Features CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, enabling seamless integration with various peripherals.
  • ROHS3 Compliance: Ensures environmental sustainability and meets regulatory standards.
  • Moisture Sensitivity Level 4 (72 Hours): Suitable for industrial environments with varying humidity levels.
  • Active Product Status: AMD maintains active support and development for this product, ensuring long-term reliability and updates.

XCZU57DR-2FSVE1156I Applications

The XCZU57DR-2FSVE1156I is ideal for applications requiring high-speed processing and versatile connectivity. Some specific use cases include:

  • Telecommunications: Ideal for 5G infrastructure, where high-speed data processing and low latency are critical.
  • Industrial Automation: Suitable for controlling complex machinery and systems, leveraging its extensive peripheral support.
  • Medical Devices: Can be used in medical imaging and diagnostic equipment, benefiting from its high-speed processing and reliability.
  • Automotive Systems: Perfect for advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI) systems, thanks to its robust connectivity options.
  • Aerospace and Defense: Utilized in radar systems, satellite communications, and other high-reliability applications.

Conclusion of XCZU57DR-2FSVE1156I

The XCZU57DR-2FSVE1156I stands out as a versatile and high-performance embedded IC chip, offering a unique blend of MPU and FPGA functionalities. Its extensive peripheral and connectivity options make it suitable for a wide range of applications, from telecommunications to aerospace. The device's compliance with ROHS3 standards and its moisture sensitivity level of 4 (72 hours) ensure its suitability for various industrial environments. AMD's active support further guarantees long-term reliability and updates. For engineers and designers seeking a robust and flexible platform, the XCZU57DR-2FSVE1156I is an excellent choice.

FAQ

What operating temperature range does XCZU57DR-2FSVE1156I support?
XCZU57DR-2FSVE1156I has an operating temperature range of -40°C ~ 100°C (TJ).
Is XCZU57DR-2FSVE1156I currently in stock?
What is XCZU57DR-2FSVE1156I?
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