AMD_XCZU5CG-2FBVB900E
original

AMD
XCZU5CG-2FBVB900E

777-XCZU5CG-2FBVB900E
IC SOC CORTEX-A53 900FCBGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
533MHz, 1.3GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
204
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XCZU5CG-2FBVB900E Description

XCZU5CG-2FBVB900E Description

The XCZU5CG-2FBVB900E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC CG series, combining a dual-core ARM® Cortex®-A53 processor (up to 1.3GHz) with a powerful UltraScale+ FPGA fabric (256K+ logic cells). Designed for demanding embedded applications, it operates within a 0°C to 100°C (TJ) temperature range and features 256KB RAM, 204 I/O pins, and advanced peripherals like DMA and watchdog timers (WDT). Packaged in a 900-ball FCBGA, this RoHS3-compliant device supports Ethernet, USB OTG, CANbus, and multiple serial interfaces, making it ideal for high-speed data processing and connectivity.

XCZU5CG-2FBVB900E Features

  • Dual Processing Architecture: Integrates FPGA programmability with ARM Cortex-A53 MCU for flexible, high-performance computing.
  • High-Speed Connectivity: Includes Ethernet, USB OTG, CANbus, SPI, I2C, and UART/USART for seamless communication.
  • Robust I/O Capability: 204 configurable I/Os enable interfacing with sensors, memory, and peripherals.
  • Wide Operating Range: 0°C to 100°C (TJ) ensures reliability in industrial environments.
  • Low Power, High Efficiency: Optimized for power-sensitive applications with 533MHz to 1.3GHz dynamic clocking.
  • Compliance & Reliability: ROHS3, REACH unaffected, and ECCN 5A002A4 XIL certified for global deployment.

XCZU5CG-2FBVB900E Applications

  • Industrial Automation: Real-time control systems with FPGA-based signal processing.
  • Embedded Vision: AI/ML inference at the edge with FPGA-accelerated algorithms.
  • Communications Infrastructure: High-speed data routing and protocol bridging.
  • Aerospace & Defense: Secure, low-latency processing for avionics and radar systems.
  • Medical Devices: Reliable, high-performance computing for imaging and diagnostics.

Conclusion of XCZU5CG-2FBVB900E

The XCZU5CG-2FBVB900E stands out for its unique hybrid architecture, combining FPGA flexibility with ARM processing power. Its rich connectivity, extended temperature range, and high I/O count make it superior to conventional SoCs in real-time, compute-intensive applications. Whether for industrial, medical, or communications use, this device delivers scalability, efficiency, and reliability, solidifying AMD's leadership in adaptive computing solutions.

FAQ

What is the mounting type of XCZU5CG-2FBVB900E?
XCZU5CG-2FBVB900E uses a SMD/SMT mounting style based on the listed product specifications.
What operating temperature range does XCZU5CG-2FBVB900E support?
What is XCZU5CG-2FBVB900E?
Does XCZU5CG-2FBVB900E have quantity-based pricing?
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