AMD_XCZU5CG-L2FBVB900E
original

AMD
XCZU5CG-L2FBVB900E

777-XCZU5CG-L2FBVB900E
IC SOC CORTEX-A53 900FCBGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
533MHz, 1.3GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
204
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XCZU5CG-L2FBVB900E Description

XCZU5CG-L2FBVB900E Description

The XCZU5CG-L2FBVB900E is a high-performance Embedded IC Chip from AMD, belonging to the Zynq® UltraScale+™ MPSoC CG series. This IC is designed to deliver exceptional performance and flexibility, making it suitable for a wide range of applications. It features a dual-core ARM Cortex-A53 processor with speeds of 533MHz and 1.3GHz, ensuring robust processing capabilities. The device operates within a temperature range of 0°C to 100°C (TJ), making it suitable for various environmental conditions. With 256KB of RAM, it provides ample memory for complex operations. The XCZU5CG-L2FBVB900E also includes a comprehensive set of peripherals such as DMA and WDT, enhancing its functionality. It supports multiple connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for embedded systems. The device is packaged in a 900FCBGA format and is available in tray packaging. It is REACH unaffected and RoHS3 compliant, ensuring environmental safety and regulatory compliance.

XCZU5CG-L2FBVB900E Features

  • Dual-Core ARM Cortex-A53 Processor: Capable of operating at speeds of 533MHz and 1.3GHz, providing high computational power.
  • Wide Operating Temperature Range: Suitable for industrial and automotive applications with a range of 0°C to 100°C (TJ).
  • 256KB RAM: Adequate memory for efficient data processing and storage.
  • Comprehensive Peripheral Set: Features DMA and WDT, enhancing the device's functionality and reliability.
  • Multiple Connectivity Options: Supports CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile.
  • 204 I/O Pins: Provides extensive connectivity options for interfacing with various peripherals and systems.
  • ECCN Classification: Classified as 5A002A4 XIL, ensuring compliance with export regulations.
  • Environmental Compliance: REACH unaffected and RoHS3 compliant, ensuring environmental safety and regulatory adherence.
  • Moisture Sensitivity Level (MSL) 4: Suitable for applications requiring a 72-hour exposure limit, ensuring reliability in humid environments.

XCZU5CG-L2FBVB900E Applications

The XCZU5CG-L2FBVB900E is ideal for a variety of applications due to its high performance and versatility. Some key applications include:

  • Industrial Automation: Its robust processing capabilities and wide temperature range make it suitable for industrial control systems.
  • Automotive Systems: The device's reliability and wide operating temperature range make it ideal for automotive applications.
  • Communication Systems: The extensive connectivity options and high-speed processing make it suitable for communication infrastructure.
  • Embedded Systems: The comprehensive set of peripherals and connectivity options make it ideal for a wide range of embedded applications.
  • Consumer Electronics: The device's high performance and low power consumption make it suitable for consumer electronics requiring high computational power.

Conclusion of XCZU5CG-L2FBVB900E

The XCZU5CG-L2FBVB900E is a highly versatile and powerful Embedded IC Chip from AMD, offering exceptional performance and flexibility. Its dual-core ARM Cortex-A53 processor, wide operating temperature range, and comprehensive set of peripherals make it for suitable a wide range of applications. The device's environmental compliance and extensive connectivity options further enhance its appeal. Whether used in industrial automation, automotive systems, communication infrastructure, or consumer electronics, the XCZU5CG-L2FBVB900E provides a reliable and high-performance solution.

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