AMD
XCZU9EG-L2FFVB1156E

777-XCZU9EG-L2FFVB1156E
IC SOC CORTEX-A53 1156FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
533MHz, 600MHz, 1.3GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
328
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XCZU9EG-L2FFVB1156E Description

XCZU9EG-L2FFVB1156E Description

The XCZU9EG-L2FFVB1156E is a high-performance System on Chip (SoC) developed by AMD, featuring a combination of an ARM Cortex-A53 processor and a powerful FPGA fabric. This device is part of the Zynq® UltraScale+™ MPSoC EG series, designed to deliver exceptional performance and flexibility for a wide range of embedded applications. The XCZU9EG-L2FFVB1156E is housed in a 1156FCBGA package, making it suitable for compact and high-density designs.

XCZU9EG-L2FFVB1156E Features

  • Architecture: The XCZU9EG-L2FFVB1156E integrates an ARM Cortex-A53 processor with a high-capacity FPGA fabric, providing a versatile platform for both processing-intensive and logic-intensive tasks.
  • Speed: The device operates at speeds of up to 1.3GHz, with additional options at 533MHz and 600MHz, ensuring optimal performance for various applications.
  • Operating Temperature: It is designed to operate within a temperature range of 0°C to 100°C (TJ), making it suitable for industrial and rugged environments.
  • RAM Size: The SoC includes 256KB of RAM, providing sufficient memory for embedded applications.
  • I/O Capabilities: With 328 I/O pins, the XCZU9EG-L2FFVB1156E offers extensive connectivity options, supporting a variety of peripherals and interfaces.
  • Peripherals: The device includes essential peripherals such as DMA and WDT, enhancing its functionality and reliability.
  • Connectivity: The XCZU9EG-L2FFVB1156E supports a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it ideal for complex embedded systems.
  • Moisture Sensitivity Level (MSL): The device has an MSL of 4 (72 Hours), ensuring it can withstand typical manufacturing processes without degradation.
  • Compliance: The XCZU9EG-L2FFVB1156E is REACH unaffected and RoHS3 compliant, meeting environmental and regulatory standards.
  • Logic Cells: The FPGA fabric includes over 599K logic cells, providing significant capacity for custom logic and processing tasks.

XCZU9EG-L2FFVB1156E Applications

The XCZU9EG-L2FFVB1156E is ideal for applications requiring high performance, flexibility, and extensive connectivity. Key use cases include:

  • Industrial Automation: The device's robust performance and extensive I/O capabilities make it suitable for controlling complex industrial processes and machinery.
  • Embedded Systems: Its combination of a powerful processor and FPGA fabric allows for efficient processing and custom logic implementation, ideal for embedded systems in various industries.
  • Networking: The XCZU9EG-L2FFVB1156E's support for Ethernet and other networking protocols makes it a strong candidate for networking equipment and IoT gateways.
  • Automotive: The device's operating temperature range and ruggedness make it suitable for automotive applications, including advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.

Conclusion of XCZU9EG-L2FFVB1156E

The XCZU9EG-L2FFVB1156E is a versatile and high-performance SoC that combines the processing power of an ARM Cortex-A53 processor with the flexibility of an FPGA fabric. Its extensive I/O capabilities, wide range of connectivity options, and robust operating temperature range make it suitable for a variety of demanding applications. The device's compliance with environmental and regulatory standards ensures it meets the requirements of modern electronics manufacturing. For applications requiring a balance of processing power, custom logic, and extensive connectivity, the XCZU9EG-L2FFVB1156E is an excellent choice.

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