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BTFW30R-3RDA7MLF
2027-BTFW30R-3RDA7MLF
PDF Datasheet
Conn Board to Board RCP 30 POS 1mm Solder RA Thru-Hole Tray
6 Weeks
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Tech Specifications
Contact Plating
Gold
Mount
Through Hole
Number of Contacts
30
Number of Positions
30
Number of Rows
2
Package Quantity
810
Packaging
Tray
Pitch
0.039inch
BTFW30R-3RDA7MLF Description
Conn Board to Board RCP 30 POS 1mm Solder RA Thru-Hole Tray
FAQ
What is the mounting type of BTFW30R-3RDA7MLF?
BTFW30R-3RDA7MLF uses a Through Hole mounting style based on the listed product specifications.
Are there related or alternative parts for BTFW30R-3RDA7MLF?
What is BTFW30R-3RDA7MLF?
What package or case is BTFW30R-3RDA7MLF available in?
What is the standard lead time for BTFW30R-3RDA7MLF?
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