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MCV-6DB

MCV-6DB Description

The MCV-6DB is a System on Module (SoM) featuring the CycloneV SoC-FPGA, designed by ARIES Embedded. This module is optimized for high performance and reliability, making it suitable for a wide range of applications in the electronics industry. With a clock speed of 800MHz, the MCV-6DB delivers robust processing capabilities. It operates efficiently within a temperature range of 0°C to 70°C, ensuring stability in various environmental conditions. The module is equipped with 4GB of flash memory and 1GB of RAM, providing ample storage and fast data access for complex tasks. Its dimensions are 2.910" L x 1.650" W (74.00mm x 42.00mm), making it compact yet powerful. The MCV-6DB is packaged in a box and features a 360-pin connector, facilitating easy integration into larger systems. It is classified under HTSUS code 8471.50.0150 and is RoHS compliant, adhering to environmental standards. The module has a moisture sensitivity level (MSL) of 1 (Unlimited), ensuring durability in storage and handling. With an ECCN of 3A991 and a REACH status of unaffected, the MCV-6DB meets international regulatory requirements. Currently in active production, this module is a reliable choice for developers and engineers seeking high-performance FPGA solutions.

MCV-6DB Features

The MCV-6DB stands out with several unique features that set it apart from similar models. Its 800MHz speed ensures rapid processing, ideal for time-sensitive applications. The 4GB flash and 1GB RAM provide significant storage and quick data retrieval, enhancing overall system performance. The wide operating temperature range of 0°C to 70°C makes it suitable for both indoor and outdoor applications, ensuring consistent performance in varying climates. The compact size of 2.910" L x 1.650" W (74.00mm x 42.00mm) allows for integration into space-constrained systems without compromising functionality. The 360-pin connector offers extensive connectivity options, facilitating seamless integration with other components. The module's RoHS compliance and REACH unaffected status ensure it meets environmental and regulatory standards, making it a responsible choice for modern electronics. The unlimited moisture sensitivity level (MSL) of 1 ensures the module remains durable during storage and handling, reducing the risk of damage. These features collectively make the MCV-6DB a versatile and reliable option for various electronic applications.

MCV-6DB Applications

The MCV-6DB is well-suited for a variety of applications due to its high performance and robust features. It is ideal for embedded systems requiring high computational power and efficient data handling. Its compact size and wide operating temperature range make it suitable for industrial automation, where space constraints and harsh environments are common. The module's extensive storage and fast processing capabilities are beneficial for IoT devices, enabling efficient data processing and storage. In telecommunications, the MCV-6DB can be used in network infrastructure components, providing reliable performance and connectivity. Its FPGA architecture allows for customizable solutions, making it adaptable to specific application needs. Whether for industrial control systems, smart devices, or network equipment, the MCV-6DB offers a reliable and high-performance solution.

Conclusion of MCV-6DB

In conclusion, the MCV-6DB is a high-performance SoM CycloneV SoC-FPGA module designed by ARIES Embedded, offering a blend of powerful processing capabilities, extensive storage, and robust features. Its 800MHz speed, 4GB flash, and 1GB RAM ensure efficient data handling and processing, making it suitable for demanding applications. The wide operating temperature range and compact size allow for versatile deployment in various environments and systems. Compliance with RoHS and REACH standards, along with an unlimited moisture sensitivity level, ensures durability and environmental responsibility. The MCV-6DB is an ideal choice for developers and engineers seeking a reliable, high-performance FPGA solution for embedded systems, industrial automation, IoT devices, and telecommunications infrastructure.