ATP Electronics, Inc._AF032GEC5X-2001EX
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ATP Electronics, Inc.
AF032GEC5X-2001EX

774-AF032GEC5X-2001EX
PDF Datasheet
IC FLASH 256GBIT EMMC 153BGA
10 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 105°C
Memory Interface
eMMC
ECCN
3A991B1A
Memory Organization
32G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
153-BGA (11.5x13)
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AF032GEC5X-2001EX Description

AF032GEC5X-2001EX Description

The AF032GEC5X-2001EX is a high-performance Memory IC Chip manufactured by ATP Electronics, Inc. This device is designed to provide robust and reliable storage solutions for a variety of electronic applications. The AF032GEC5X-2001EX features a 256Gbit (32GB) eMMC memory interface, organized in a 32G x 8 configuration. It is packaged in a 153-BGA format, making it suitable for surface mount applications. The product is currently in an active status, ensuring its availability for ongoing projects and new developments.

AF032GEC5X-2001EX Features

  • Memory Interface: The AF032GEC5X-2001EX utilizes an eMMC interface, which is known for its high-speed data transfer capabilities and efficient power management. This interface is ideal for applications requiring fast read/write operations and low power consumption.
  • Memory Organization: With a memory organization of 32G x 8, this chip offers a substantial storage capacity in a compact form factor. This organization ensures efficient memory management and high performance.
  • Mounting Type: The surface mount technology (SMT) used in the AF032GEC5X-2001EX allows for easy integration into modern electronic devices. The 153-BGA package is designed to withstand the rigors of surface mount processes, ensuring durability and reliability.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 hours), the AF032GEC5X-2001EX is suitable for environments with varying humidity levels, making it ideal for a wide range of industrial applications.
  • Compliance: The AF032GEC5X-2001EX is REACH unaffected and ROHS3 compliant, meeting the stringent environmental and safety standards required by the electronics industry. This compliance ensures that the product is safe for use in various markets and applications.
  • Packaging: The device is packaged in a tray format, which facilitates easy handling and storage during manufacturing and assembly processes.

AF032GEC5X-2001EX Applications

The AF032GEC5X-2001EX is ideal for a variety of applications due to its high storage capacity, efficient power management, and robust design. Some specific use cases include:

  • Consumer Electronics: Ideal for smartphones, tablets, and other portable devices that require high-speed storage and low power consumption.
  • Industrial Systems: Suitable for embedded systems, industrial controllers, and IoT devices that need reliable storage solutions in varying environmental conditions.
  • Automotive Applications: The durability and reliability of the AF032GEC5X-2001EX make it a good fit for automotive infotainment systems and advanced driver assistance systems (ADAS).
  • Medical Devices: The device's compliance with industry standards makes it suitable for medical equipment that requires high reliability and data integrity.

Conclusion of AF032GEC5X-2001EX

The AF032GEC5X-2001EX from ATP Electronics, Inc. stands out as a reliable and high-performance memory solution for a wide range of applications. Its 256Gbit eMMC interface, surface mount compatibility, and compliance with industry standards make it a versatile choice for both consumer and industrial electronics. The device's moisture sensitivity level and packaging options further enhance its suitability for diverse environments and manufacturing processes. Whether for consumer devices, industrial systems, automotive applications, or medical equipment, the AF032GEC5X-2001EX offers a robust and efficient storage solution that meets the demands of modern electronics.

FAQ

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The standard lead time for AF032GEC5X-2001EX is 10 Weeks.
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