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4116R-2-330

4116R-2-330 Description

The 4116R-2-330 from Bourns Inc. is a high-performance 15-resistor bussed network housed in a 16-pin DIP package. Designed for precision and reliability, this resistor array features a 33Ω resistance per element with a tight ±1Ω tolerance, ensuring consistent performance in demanding circuits. Its ±250ppm/°C temperature coefficient and 50ppm/°C resistor-ratio drift enhance stability across varying thermal conditions. The device operates at 125mW power per element and is packaged in a through-hole mountable tube, making it suitable for automated assembly processes. With dimensions of 0.865" x 0.300" (21.97mm x 7.62mm) and a seated height of 0.185" (4.69mm), it offers a compact footprint for space-constrained applications.

4116R-2-330 Features

• 15-resistor bussed network for simplified circuit design.
• 33Ω resistance with ±1Ω tolerance for high precision.
• ±250ppm/°C temperature coefficient ensures minimal resistance drift.
• 50ppm/°C resistor-ratio drift for improved thermal stability.
• 125mW power rating per element for robust performance.
• Through-hole DIP package (16-pin) for easy integration.
• Compact dimensions (21.97mm x 7.62mm) save board space.
• REACH compliant and EAR99/ECCN classified for global usability.
• Moisture Sensitivity Level (MSL): Not Applicable, ideal for non-humidity-critical environments.

4116R-2-330 Applications

The 4116R-2-330 is ideal for:

• Voltage division and current limiting in analog/digital circuits.
• Pull-up/pull-down resistor networks in microcontrollers and FPGAs.
• Signal conditioning in sensor interfaces and data acquisition systems.
• Industrial automation where precision and thermal stability are critical.
• Consumer electronics, including audio equipment and display drivers.
• Automotive electronics requiring reliable performance under thermal stress.

Conclusion of 4116R-2-330

The 4116R-2-330 resistor array stands out for its precision, thermal stability, and compact design, making it a superior choice for engineers seeking reliability in high-performance applications. Its bussed configuration simplifies PCB layout, while the through-hole package ensures durability. Whether used in industrial, automotive, or consumer electronics, this Bourns product delivers consistent performance under varying operational conditions.