Bourns, Inc._4116R-2-561
original

Bourns, Inc.
4116R-2-561

50-4116R-2-561
PDF Datasheet
RES ARRAY 15 RES 560 OHM 16DIP
12 Weeks

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Tech Specifications

Number of Resistors
15
Height - Seated (Max)
0.185" (4.69mm)
Temperature Coefficient
±100ppm/°C
Product Status
Active
Supplier Device Package
16-DIP
Package / Case
16-DIP (0.300", 7.62mm)
REACH Status
REACH Affected
Mfr
Bourns Inc.
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4116R-2-561 Description

4116R-2-561 Description

The 4116R-2-561 from Bourns Inc. is a high-performance 15-resistor bussed network designed for precision applications in electronic circuits. Housed in a 16-pin DIP package with through-hole mounting, this resistor array offers a 560Ω resistance per element with a tight ±2% tolerance and a low ±100ppm/°C temperature coefficient. Its compact dimensions (0.865" x 0.300") and 0.185" seated height make it suitable for space-constrained PCB designs. The device operates at 125mW power per element and features a 50ppm/°C resistor-ratio drift, ensuring stable performance under varying thermal conditions.

4116R-2-561 Features

  • 15-resistor bussed network for simplified circuit design.
  • 560Ω resistance with ±2% tolerance for precision applications.
  • Low TCR (±100ppm/°C) and 50ppm/°C ratio drift for thermal stability.
  • Through-hole DIP package for robust mechanical mounting.
  • 125mW power rating per element for reliable operation.
  • REACH compliant and EAR99/ECCN classified for global usability.
  • Not MSL-sensitive, eliminating moisture-related handling concerns.

4116R-2-561 Applications

Ideal for analog signal conditioning, voltage division, and pull-up/down networks, the 4116R-2-561 excels in:

  • Industrial control systems requiring stable resistor ratios.
  • Test and measurement equipment demanding precision resistance.
  • Consumer electronics where space and reliability are critical.
  • Automotive electronics due to its robust thermal performance.
  • Legacy PCB designs needing through-hole compatibility.

Conclusion of 4116R-2-561

The Bourns 4116R-2-561 combines precision, thermal stability, and compactness, making it a superior choice for bussed resistor networks. Its ±2% tolerance, low TCR, and high power rating distinguish it from generic arrays, while its DIP packaging ensures ease of integration. Whether for industrial, automotive, or consumer applications, this resistor network delivers consistent performance in demanding environments.

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