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4308H-101-104

4308H-101-104 Description

The 4308H-101-104 from Bourns Inc. is a high-performance 7-resistor bussed network designed for precision applications. Housed in an 8-pin SIP (Single In-Line Package), it features a compact 0.784" x 0.085" (19.91mm x 2.16mm) footprint with a seated height of 0.350" (8.89mm), making it suitable for space-constrained designs. Each resistor offers a 100kΩ resistance with a tight ±2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The 300mW power rating per element and 50ppm/°C resistor-ratio drift further enhance reliability in demanding circuits.

4308H-101-104 Features

• 7-resistor bussed array simplifies circuit design by reducing component count.
• Low TCR (±100ppm/°C) and ±2% tolerance for precision signal conditioning.
• 300mW power dissipation per resistor, ideal for moderate-power applications.
• Through-hole mounting ensures robust mechanical stability.
• REACH compliant and EAR99/ECCN classified for global regulatory adherence.
• Non-MSAL (Not Applicable) moisture sensitivity, eliminating baking requirements.
• Tube packaging for safe handling and automated assembly.

4308H-101-104 Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down circuits in analog/digital systems.
• Sensor signal conditioning where stable resistance ratios are critical.
• Industrial control systems requiring high reliability under thermal stress.
• Consumer electronics (e.g., audio equipment, displays) due to its compact form factor.
• Automotive electronics where low drift and durability are prioritized.

Conclusion of 4308H-101-104

The 4308H-101-104 combines precision, power efficiency, and compactness, making it a versatile choice for engineers seeking reliable resistor networks. Its bussed architecture reduces layout complexity, while Bourns' quality assurance ensures long-term performance. Ideal for both prototyping and mass production, this model stands out in applications demanding thermal stability and space savings.