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4309R-101-104LF

4309R-101-104LF Description

The 4309R-101-104LF from Bourns Inc. is an 8-resistor bussed network array housed in a compact 9-pin SIP (Single In-line Package). Designed for through-hole mounting, it offers a 100kΩ resistance per element with a tight ±2% tolerance, ensuring reliable performance in precision circuits. The device operates within a ±100ppm/°C temperature coefficient range, with a 50ppm/°C resistor-ratio drift, making it stable under thermal variations. Its 200mW power rating per element and ROHS3/REACH compliance align with modern environmental and performance standards. The 4300R series construction ensures durability, while its 4.95mm max height and 22.45mm × 2.16mm footprint suit space-constrained designs.

4309R-101-104LF Features

• High-Density Integration: Combines 8 resistors in a single SIP package, reducing PCB footprint.
• Stable Performance: Low ±100ppm/°C TCR and 50ppm/°C ratio drift enhance thermal stability.
• Precision Tolerance: ±2% resistance tolerance for consistent signal conditioning.
• Robust Power Handling: 200mW per resistor supports moderate power applications.
• Environmental Compliance: ROHS3 and REACH certified, meeting global regulatory requirements.
• Non-MSLAssessed: Not Applicable moisture sensitivity simplifies storage and handling.

4309R-101-104LF Applications

Ideal for analog signal processing, voltage division, and pull-up/pull-down networks in:

• Industrial Control Systems: Precision resistor networks for sensor interfaces.
• Consumer Electronics: Space-saving solutions in audio equipment and displays.
• Automotive Electronics: Stable performance in infotainment and ECU circuits.
• Test & Measurement Equipment: High-accuracy divider networks for calibration.

Conclusion of 4309R-101-104LF

The 4309R-101-104LF excels in applications demanding compactness, thermal stability, and precision. Its bussed architecture simplifies circuit design, while Bourns' quality ensures long-term reliability. A cost-effective choice for engineers prioritizing performance, compliance, and space efficiency in through-hole designs.