


Bourns, Inc.
4416P-2-222
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
4416P-2-222 Description
4416P-2-222 Description
The 4416P-2-222 from Bourns Inc. is a high-performance 15-resistor bussed network designed for precision surface-mount applications. Encased in a compact 16-pin SOIC package with dimensions of 0.410" x 0.295" (10.41mm x 7.50mm) and a low-profile height of 0.114" (2.90mm), this resistor array is optimized for space-constrained PCB designs. Each resistor offers a 2.2kΩ resistance with a tight ±2% tolerance and a stable ±100ppm/°C temperature coefficient, ensuring reliable performance across varying environmental conditions. The device operates at 160mW power per element and is rated for MSL 1 (Unlimited) moisture sensitivity, making it suitable for extended storage and handling.
4416P-2-222 Features
- 15-resistor bussed network simplifies circuit design by reducing component count.
- 2.2kΩ ±2% tolerance ensures consistent signal integrity in precision applications.
- ±100ppm/°C TCR and 50ppm/°C resistor-ratio drift enhance thermal stability.
- Compact 16-SOIC package (10.41mm x 7.50mm) saves board space.
- 160mW power rating per resistor supports moderate power dissipation.
- MSL 1 (Unlimited) rating allows flexible storage and assembly.
- REACH and EAR99 compliant, meeting global environmental and export standards.
4416P-2-222 Applications
This resistor array is ideal for:
- Voltage division and pull-up/down networks in digital circuits.
- Signal conditioning for sensors and ADCs in industrial automation.
- Impedance matching in communication systems.
- Consumer electronics, such as smart devices and wearables, where space efficiency is critical.
- Automotive electronics, benefiting from its robust thermal performance.
Conclusion of 4416P-2-222
The Bourns 4416P-2-222 resistor network stands out for its precision, compactness, and reliability, making it a superior choice for engineers designing high-density PCBs. Its bussed architecture, low TCR, and MSL 1 rating provide a competitive edge in applications demanding stability and ease of assembly. Whether for industrial, automotive, or consumer electronics, this component delivers consistent performance while streamlining BOM complexity.



.png)









.png?x-oss-process=image/format,webp/resize,h_32)










