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4604X-101-203LF

4604X-101-203LF Description

The 4604X-101-203LF from Bourns Inc. is a high-performance 3-resistor bussed network designed for precision applications in electronic circuits. With a 20k ohm resistance per element and a tight ±2% tolerance, this through-hole-mounted array ensures reliable signal conditioning and voltage division. Its compact 0.398" x 0.098" (10.11mm x 2.49mm) footprint and 5.08mm seated height make it ideal for space-constrained designs. The device operates within a ±100ppm/°C temperature coefficient, ensuring stability across varying environmental conditions. Compliant with ROHS3 and REACH standards, it is suitable for global markets.

4604X-101-203LF Features

• 3-resistor bussed network with 4-pin SIP configuration for simplified PCB layout.
• 200mW power rating per element, offering robust performance in low-to-medium power applications.
• Wide operating temperature range supported by a low ±100ppm/°C thermal drift.
• Through-hole mounting ensures mechanical durability and ease of assembly.
• Non-MSLA (Moisture Sensitivity Level Not Applicable) eliminates baking requirements, reducing production delays.
• Bulk packaging for cost-effective high-volume procurement.

4604X-101-203LF Applications

This resistor network excels in:

• Voltage division and pull-up/down circuits in microcontroller and FPGA designs.
• Signal conditioning for sensors, ADCs, and DACs in industrial automation.
• Consumer electronics, including audio equipment and power management systems.
• Automotive electronics, where stable resistance under thermal stress is critical.
• Prototyping and educational kits due to its ease of use and reliability.

Conclusion of 4604X-101-203LF

The 4604X-101-203LF combines precision, compactness, and thermal stability, making it a versatile choice for engineers seeking reliable resistor networks. Its bussed architecture simplifies circuit design, while Bourns' quality assurance ensures long-term performance. Whether for industrial, automotive, or consumer applications, this component delivers consistent results with minimal footprint overhead.