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4606H-101-101LF

4606H-101-101LF Description

The 4606H-101-101LF from Bourns Inc. is a high-performance 5-resistor bussed network designed for precision applications in electronic circuits. This through-hole-mounted device features a compact 6-pin SIP (Single In-Line Package) with a 100Ω resistance per element, offering a tight ±2% tolerance and a low ±100ppm/°C temperature coefficient. Its 300mW power rating per element ensures reliable operation in demanding environments, while the 50ppm/°C resistor-ratio drift enhances stability in differential signal processing. The ROHS3-compliant and REACH-unaffected construction makes it suitable for modern eco-conscious designs.

4606H-101-101LF Features

• Bussed Circuit Configuration: Simplifies PCB layout by connecting resistors in a common-node arrangement.
• High Power Handling: 300mW per resistor supports robust performance in power-sensitive applications.
• Low TCR & Ratio Drift: ±100ppm/°C TCR and 50ppm/°C ratio drift ensure minimal resistance variation under thermal stress.
• Compact SIP Package: 0.598" x 0.098" (15.19mm x 2.49mm) footprint with 0.350" (8.89mm) height saves board space.
• Industrial-Grade Reliability: Not MSL-rated (non-moisture-sensitive) and EAR99/ECCN compliant for broad market use.

4606H-101-101LF Applications

Ideal for voltage division, pull-up/pull-down networks, and current-limiting circuits, this array excels in:

• Industrial Control Systems: Stable performance in PLCs and motor drives.
• Automotive Electronics: Resistant to thermal fluctuations in sensors and infotainment systems.
• Consumer Electronics: Durable solution for power management in appliances.
• Test & Measurement Equipment: Precision resistance networks for calibration and signal conditioning.

Conclusion of 4606H-101-101LF

The 4606H-101-101LF combines Bourns' quality with a balanced blend of precision, power efficiency, and compactness, making it a superior choice over generic resistor arrays. Its bussed design and low drift are particularly advantageous for applications requiring consistent performance across temperature variations. Engineers seeking a cost-effective, high-reliability solution for space-constrained or thermally challenging designs will find this model indispensable.