


Bourns, Inc.
4606M-101-560LF
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4606M-101-560LF Description
4606M-101-560LF Description
The 4606M-101-560LF from Bourns Inc. is a high-performance 5-resistor bussed network designed for precision applications in electronic circuits. With a resistance value of 56Ω per element and a tight ±2% tolerance, this component ensures reliable signal integrity and consistent performance. The device features a through-hole mounting configuration with 6 pins in a compact SIP (Single In-line Package) format, measuring 0.598" x 0.098" (15.19mm x 2.49mm) and a seated height of 0.250" (6.35mm). Its ±100ppm/°C temperature coefficient and 50ppm/°C resistor-ratio drift make it suitable for environments with fluctuating thermal conditions.
4606M-101-560LF Features
- Bussed Circuit Configuration: Simplifies PCB layout by connecting resistors in a common-node arrangement.
- High Power Handling: 250mW per resistor ensures durability in demanding applications.
- Stable Performance: Low ±100ppm/°C TCR and 50ppm/°C ratio drift enhance precision.
- Robust Construction: ROHS3 Compliant and REACH Unaffected, meeting stringent environmental standards.
- Wide Compatibility: EAR99 ECCN and Not MSL-rated (Moisture Sensitivity Level) for flexible use in industrial and commercial systems.
4606M-101-560LF Applications
This resistor network is ideal for:
- Voltage Division Circuits: Ensures accurate signal scaling in analog systems.
- Pull-up/Pull-down Networks: Provides stable biasing for digital logic interfaces.
- Industrial Control Systems: Withstands harsh conditions due to its robust thermal and electrical specs.
- Consumer Electronics: Compact size and reliability suit space-constrained designs like audio equipment or power supplies.
- Automotive Electronics: Stable performance under temperature variations aligns with automotive-grade requirements.
Conclusion of 4606M-101-560LF
The 4606M-101-560LF stands out for its precision, durability, and ease of integration, making it a superior choice for engineers seeking reliable resistor networks. Its bussed architecture, low drift, and high power rating offer distinct advantages over generic arrays, particularly in thermal-sensitive or high-density PCB designs. Whether for industrial, automotive, or consumer applications, this Bourns component delivers consistent performance and long-term reliability.



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