
Bourns, Inc.
4606X-101-472
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4606X-101-472 Description
4606X-101-472 Description
The 4606X-101-472 from Bourns Inc. is a 5-resistor bussed network in a 6-pin SIP (Single In-line Package), designed for through-hole mounting. It features a 4.7kΩ resistance per element with a tight ±2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The compact 0.598" x 0.098" (15.19mm x 2.49mm) footprint and 5.08mm seated height make it suitable for space-constrained applications. Rated at 200mW power per element, this obsolete but REACH-unaffected component remains a reliable choice for legacy designs.
4606X-101-472 Features
- Bussed Circuit Configuration: Simplifies PCB layout by connecting resistors in a common-node topology.
- High Power Handling: 200mW per resistor outperforms many thin-film arrays in power dissipation.
- Stable Performance: ±100ppm/°C TCR ensures minimal resistance drift under thermal stress.
- Robust Construction: Through-hole design enhances mechanical durability versus surface-mount alternatives.
- Legacy Compatibility: Ideal for maintaining or repairing older systems due to its obsolete-but-unaffected REACH status.
4606X-101-472 Applications
- Industrial Control Systems: Used in PLCs and sensor interfaces for signal conditioning.
- Power Supplies: Acts as voltage dividers or pull-up/down networks in analog circuits.
- Legacy Electronics Repair: Critical for servicing outdated equipment requiring through-hole components.
- Automotive Electronics: Suitable for non-critical bussed resistor networks in dashboards or lighting controls.
- Test & Measurement Equipment: Provides stable reference resistances in calibration tools.
Conclusion of 4606X-101-472
The 4606X-101-472 offers a balance of precision, power handling, and compactness, making it a pragmatic choice for bussed resistor applications. While obsolete, its REACH compliance and through-hole reliability ensure continued utility in industrial, automotive, and legacy systems. Engineers valuing thermal stability and ease of integration will find this array a cost-effective solution for bulk PCB designs.



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