
Bourns, Inc.
4607X-101-511LF
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4607X-101-511LF Description
4607X-101-511LF Description
The 4607X-101-511LF from Bourns Inc. is a high-performance 6-resistor bussed network designed for precision applications in electronic circuits. With a 510Ω resistance per element and a tight ±2% tolerance, this through-hole-mounted array ensures reliable signal conditioning and voltage division. Its compact 0.698" x 0.098" (17.73mm x 2.49mm) footprint and 5.08mm seated height make it ideal for space-constrained PCB designs. The ±100ppm/°C temperature coefficient guarantees stable performance across varying environmental conditions, while the 200mW power rating per resistor balances efficiency and durability.
4607X-101-511LF Features
- 6 bussed resistors in a 7-pin SIP configuration, simplifying circuit layout.
- ROHS3 compliant and REACH unaffected, meeting stringent environmental standards.
- Non-MSAL (Not Applicable) rating ensures no moisture sensitivity concerns during assembly.
- Bulk packaging for cost-effective high-volume production.
- Wide operating temperature range supported by low TCR (±100ppm/°C).
- 200mW power dissipation per element, superior to thinner-film alternatives.
4607X-101-511LF Applications
This resistor network excels in:
- Voltage dividers and pull-up/pull-down circuits in industrial control systems.
- Signal conditioning for sensors and ADCs in automotive electronics.
- Power supply feedback networks due to its stable tolerance and low TCR.
- Consumer electronics, where space efficiency and reliability are critical.
- Prototyping and breadboarding, thanks to its through-hole design and bussed topology.
Conclusion of 4607X-101-511LF
The 4607X-101-511LF combines Bourns' proven reliability with a robust design, offering engineers a versatile solution for precision analog circuits. Its high power rating, tight tolerance, and environmental compliance make it a standout choice for demanding applications. Whether for industrial, automotive, or consumer electronics, this resistor network delivers consistent performance while streamlining PCB assembly and reducing component count.



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