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4608X-101-105 Description
4608X-101-105 Description
The 4608X-101-105 from Bourns Inc. is a 7-resistor bussed network housed in an 8-pin SIP (Single In-line Package) configuration. Designed for through-hole mounting, this 1MΩ ±2% tolerance array offers a compact footprint of 0.798" x 0.098" (20.27mm x 2.49mm) with a seated height of 5.08mm, making it suitable for space-constrained PCB designs. The device operates within a ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. Rated at 200mW per element, it balances power handling with precision, while its REACH Unaffected and EAR99/ECCN compliance simplifies global sourcing. Though marked Obsolete, it remains a reliable choice for legacy or low-volume production.
4608X-101-105 Features
- High-Density Integration: Combines 7 resistors in a single 8-pin SIP package, reducing board space and assembly complexity.
- Stable Performance: ±100ppm/°C temperature coefficient minimizes resistance drift under thermal stress.
- Robust Construction: Through-hole design ensures mechanical durability for industrial applications.
- Wide Compatibility: 1MΩ bussed network with ±2% tolerance suits precision analog and digital circuits.
- Simplified Logistics: Not MSL-rated (Moisture Sensitivity Level) and bulk packaged, easing storage and handling.
4608X-101-105 Applications
Ideal for legacy electronics repair, test equipment, and industrial control systems where consistent resistance values are critical. Its bussed topology is optimal for:
- Voltage divider networks in sensor interfaces.
- Pull-up/pull-down resistor arrays for microcontrollers and logic circuits.
- Signal conditioning in audio or instrumentation PCBs.
- Retrofit designs requiring through-hole compatibility.
Conclusion of 4608X-101-105
The 4608X-101-105 excels in delivering space savings, thermal stability, and ease of integration for through-hole designs. While obsolete, its 200mW power rating, tight tolerance, and robust SIP package make it a pragmatic choice for niche applications. Engineers sourcing alternatives should consider Bourns' modern equivalents but may leverage this model for cost-sensitive or legacy system support.



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