


Bourns, Inc.
4609X-101-221LF
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4609X-101-221LF Description
4609X-101-221LF Description
The 4609X-101-221LF from Bourns Inc. is an 8-resistor bussed network array designed for precision through-hole applications. With a compact SIP (Single In-Line Package) footprint of 0.898" L × 0.098" W (22.81mm × 2.49mm) and a seated height of 0.200" (5.08mm), this component offers space-efficient integration. Each resistor features a 220Ω ±2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The 200mW power rating per element and ROHS3/REACH compliance make it suitable for modern, eco-conscious designs.
4609X-101-221LF Features
- High-Density Integration: Combines 8 resistors in a 9-pin SIP package, reducing PCB footprint.
- Precision Performance: Tight tolerance (±2%) and low TCR (±100ppm/°C) ensure reliability in signal conditioning and voltage division.
- Robust Construction: Through-hole mounting provides mechanical stability for industrial applications.
- Compliance: Meets ROHS3 and REACH standards, with EAR99/ECCN classification for unrestricted global use.
- Non-MSIL Rated: "Not Applicable" moisture sensitivity simplifies handling and storage.
4609X-101-221LF Applications
Ideal for analog signal processing, pull-up/pull-down networks, and voltage divider circuits in:
- Industrial Control Systems: PLCs and sensor interfaces requiring stable resistance values.
- Consumer Electronics: Audio equipment and display drivers where space optimization is critical.
- Automotive Electronics: Non-critical bussed networks in dashboards or infotainment systems.
- Test & Measurement: Calibration circuits benefiting from matched resistor values.
Conclusion of 4609X-101-221LF
The 4609X-101-221LF stands out for its compact design, precision, and compliance with environmental standards. Its bussed architecture simplifies circuit design while maintaining performance, making it a versatile choice for both prototyping and mass production. Engineers will appreciate its balance of density, reliability, and ease of integration in demanding electronic systems.



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