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4609X-AP1-152LF

4609X-AP1-152LF Description

The 4609X-AP1-152LF from Bourns Inc. is a high-performance 8-resistor bussed network designed for precision applications in electronic circuits. With a 1.5kΩ resistance per element and a tight ±2% tolerance, this device ensures reliable signal conditioning and voltage division. Its through-hole mounting (9-pin SIP package) and robust 200mW power rating per resistor make it suitable for demanding environments. The ±100ppm/°C temperature coefficient guarantees stable performance across varying thermal conditions. Encased in a compact 0.898" x 0.098" (22.81mm x 2.49mm) footprint, it balances space efficiency with durability.

4609X-AP1-152LF Features

• 8 bussed resistors in a single SIP package, reducing PCB footprint and assembly complexity.
• 1.5kΩ resistance with ±2% tolerance for precise circuit matching.
• 200mW power dissipation per element, ideal for moderate-power applications.
• Low TCR (±100ppm/°C), ensuring minimal resistance drift over temperature.
• Through-hole design (9-pin) for secure mechanical attachment.
• RoHS3/REACH compliant, meeting environmental and safety standards.
• Non-MSAL (Not Applicable) rating, eliminating moisture sensitivity concerns.

4609X-AP1-152LF Applications

This resistor network excels in:

• Voltage dividers and pull-up/down circuits in industrial control systems.
• Signal conditioning for sensors and analog interfaces.
• Power supply feedback networks, leveraging its stable TCR and tolerance.
• Legacy through-hole designs where reliability and ease of servicing are critical.
• Automotive and industrial electronics, thanks to its rugged construction and consistent performance.

Conclusion of 4609X-AP1-152LF

The 4609X-AP1-152LF combines precision, power handling, and compactness, making it a versatile choice for engineers seeking reliability in bussed resistor networks. Its Bourns 4600X series heritage ensures proven quality, while features like low TCR and high tolerance cater to precision-critical designs. Ideal for both prototyping and mass production, this component is a cost-effective solution for space-constrained, thermally variable applications.