


Bourns, Inc.
4611X-101-273LF
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4611X-101-273LF Description
4611X-101-273LF Description
The 4611X-101-273LF from Bourns Inc. is a high-performance 10-resistor bussed network designed for precision applications in electronic circuits. This through-hole-mounted array features a 27kΩ resistance per element with a tight ±2% tolerance, ensuring reliable signal conditioning and voltage division. Its compact 1.098" x 0.098" (27.89mm x 2.49mm) footprint and 11-pin SIP configuration make it ideal for space-constrained designs. The device operates with a 200mW power rating per resistor and maintains stability across temperatures with a ±100ppm/°C coefficient, suitable for industrial and automotive environments.
4611X-101-273LF Features
- Bussed Circuit Topology: Simplifies PCB layout by connecting resistors in a common-node configuration.
- High Power Handling: 200mW per element ensures durability in demanding applications.
- Low TCR (±100ppm/°C): Minimizes resistance drift under thermal stress.
- RoHS3/REACH Compliance: Meets environmental and safety standards for global use.
- Non-MSIL (Not Applicable): Eliminates moisture sensitivity concerns during storage and assembly.
- Tape & Reel Packaging: Optimized for automated pick-and-place processes.
4611X-101-273LF Applications
This resistor network excels in:
- Voltage Dividers: Precision attenuation in sensor interfaces or ADC circuits.
- Pull-Up/Pull-Down Networks: Signal integrity in digital systems (e.g., microcontrollers).
- Industrial Controls: Stable performance in PLCs and motor drivers.
- Automotive Electronics: Reliable operation in infotainment or ECU designs.
- Consumer Electronics: Durable solution for power management or LED drivers.
Conclusion of 4611X-101-273LF
The 4611X-101-273LF combines high density, precision, and robustness, making it a superior choice for engineers seeking repeatable performance in harsh environments. Its bussed architecture reduces component count, while Bourns' quality assurance guarantees long-term reliability. Ideal for both prototyping and mass production, this array bridges the gap between cost efficiency and technical excellence.



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