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4814P-2-271

4814P-2-271 Description

The 4814P-2-271 from Bourns Inc. is a high-performance 13-resistor bussed network housed in a compact 14-pin SOIC package, designed for surface-mount applications. With a 270-ohm resistance per element and a tight ±2% tolerance, this device ensures reliable signal conditioning and voltage division in precision circuits. Its ±100ppm/°C temperature coefficient guarantees stable performance across varying thermal conditions, while the 80mW power rating per resistor balances efficiency with durability. The 0.390" x 0.220" (9.91mm x 5.59mm) footprint and 2.40mm profile make it ideal for space-constrained designs. Compliant with REACH and EAR99/HSUS 8533.21.0010, it is packaged in Tape & Reel (TR) for automated assembly.

4814P-2-271 Features

• 13-resistor bussed array simplifies circuit design by reducing component count.
• 270Ω ±2% tolerance ensures precision in voltage division and current limiting.
• Low TCR (±100ppm/°C) minimizes resistance drift under thermal stress.
• 80mW power dissipation per element suits moderate-power applications.
• Compact 14-SOIC package (9.91mm x 5.59mm) optimizes PCB real estate.
• MSL 1 (Unlimited shelf life) eliminates baking requirements before reflow.
• REACH/EAR99 compliant for global regulatory adherence.

4814P-2-271 Applications

This resistor network excels in:

• Analog signal conditioning (e.g., sensor interfaces, ADC/DAC circuits).
• Voltage division in power management and feedback loops.
• Pull-up/down networks for digital I/O lines in microcontrollers.
• Industrial automation systems requiring stable, high-density resistor arrays.
• Consumer electronics (e.g., smart devices, displays) where space and reliability are critical.

Conclusion of 4814P-2-271

The 4814P-2-271 combines precision, compactness, and robustness, making it a superior choice for applications demanding stable resistance networks in constrained layouts. Its bussed architecture reduces BOM complexity, while Bourns' quality assurance ensures long-term reliability. Ideal for industrial, automotive, and consumer electronics, this model stands out for its thermal stability, tight tolerance, and ease of integration in automated assembly processes.