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4814P-2-333LF

4814P-2-333LF Description

The 4814P-2-333LF from Bourns Inc. is a high-performance 13-resistor bussed network designed for precision surface-mount applications. Encased in a compact 14-SOIC package (9.91mm x 5.59mm), it features a 33kΩ resistance per element with a tight ±2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. With a power rating of 80mW per resistor and RoHS3/REACH compliance, this active-status component is ideal for modern electronics requiring reliability and miniaturization. Its bussed circuit topology simplifies PCB layout by connecting multiple resistors to a common node, reducing design complexity.

4814P-2-333LF Features

• 13-resistor bussed array in a space-saving 14-pin SOIC footprint.
• 33kΩ resistance with ±2% tolerance for precision applications.
• Low TCR (±100ppm/°C) minimizes resistance drift under thermal stress.
• 80mW power dissipation per element balances performance and thermal management.
• Surface-mount design (MSL 1) enables automated assembly and reflow compatibility.
• RoHS3/REACH compliant and EAR99/ECCN classified for global supply chain flexibility.
• Tape & Reel (TR) packaging optimizes high-volume production efficiency.

4814P-2-333LF Applications

This resistor network excels in:

• Voltage division and pull-up/down circuits in microcontrollers and FPGAs.
• Signal conditioning for sensors, ADCs, and DACs in industrial/automotive systems.
• Impedance matching in communication interfaces (I2C, SPI).
• Power supply feedback networks requiring stable, matched resistances.
• Consumer electronics (smartphones, wearables) where board space is critical.

Conclusion of 4814P-2-333LF

The 4814P-2-333LF combines Bourns' expertise in resistor arrays with a robust 33kΩ bussed design, offering engineers a reliable, space-efficient solution for precision circuits. Its low TCR, tight tolerance, and 80mW rating make it superior to generic arrays in thermal stability and power handling. Ideal for high-density PCBs and harsh environments, this network simplifies design while meeting stringent industry standards. A top choice for applications demanding repeatability, miniaturization, and compliance.