


Bourns, Inc.
4814P-2-470
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4814P-2-470 Description
4814P-2-470 Description
The 4814P-2-470 from Bourns Inc. is a high-performance 13-resistor bussed network housed in a compact 14-pin SOIC package, designed for precision surface-mount applications. With a 47Ω resistance per element and a tight tolerance of ±1Ω, this device ensures reliable signal integrity and current distribution in dense PCB layouts. Its ±250ppm/°C temperature coefficient and 80mW power rating per resistor make it suitable for stable operation across varying environmental conditions. The 0.094" (2.40mm) low-profile height and 9.91mm x 5.59mm footprint optimize space efficiency, while the Tape & Reel (TR) packaging streamlines automated assembly processes.
4814P-2-470 Features
- 13-resistor bussed array simplifies circuit design by reducing component count.
- 47Ω ±1Ω tolerance ensures consistent performance in precision applications.
- ±250ppm/°C TCR maintains stability across temperature fluctuations.
- 80mW power dissipation per element balances compact size with robust handling.
- Surface-mount SOIC package (9.91mm x 5.59mm) ideal for high-density PCBs.
- MSL 1 (Unlimited) rating allows extended floor life without moisture sensitivity concerns.
- REACH/EAR99 compliant, meeting global environmental and export standards.
4814P-2-470 Applications
This resistor network excels in:
- Voltage division and pull-up/down circuits in microcontrollers and FPGAs.
- Signal conditioning for sensors, ADCs, and DACs in industrial automation.
- Current-limiting networks in power management ICs and LED drivers.
- Impedance matching for high-speed communication interfaces (e.g., SPI, I²C).
- Space-constrained designs like wearables and IoT devices, where board real estate is critical.
Conclusion of 4814P-2-470
The 4814P-2-470 combines Bourns' reliability with a compact, high-density design, offering engineers a cost-effective solution for reducing BOM complexity. Its low TCR, tight tolerance, and bussed topology make it superior to discrete resistors in applications demanding uniformity and space savings. Ideal for both prototyping and mass production, this network is a versatile choice for modern electronics requiring precision and efficiency.



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