


Bourns, Inc.
4814P-2-471
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4814P-2-471 Description
4814P-2-471 Description
The 4814P-2-471 from Bourns Inc. is a high-performance 13-resistor bussed network housed in a compact 14-pin SOIC package. Designed for surface-mount applications, it offers a 470Ω resistance per element with a tight ±2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. With a power rating of 80mW per resistor and a moisture sensitivity level (MSL) of 1 (Unlimited), this component is robust for industrial and commercial use. Its 0.390" x 0.220" (9.91mm x 5.59mm) footprint and 2.40mm max height make it ideal for space-constrained PCB designs.
4814P-2-471 Features
- 13-resistor bussed array simplifies circuit design by reducing component count.
- 470Ω ±2% tolerance ensures precision in voltage division and current limiting.
- ±100ppm/°C TCR provides reliable performance across temperature fluctuations.
- 80mW power rating per element supports moderate power applications.
- Surface-mount SOIC package (14-pin) with Tape & Reel (TR) packaging for automated assembly efficiency.
- MSL 1 (Unlimited) allows extended floor life without moisture protection.
- REACH and EAR99 compliant, meeting global environmental and export standards.
4814P-2-471 Applications
This resistor network excels in analog signal conditioning, pull-up/pull-down circuits, and I/O port termination in:
- Industrial control systems requiring stable resistance in harsh environments.
- Consumer electronics (e.g., TVs, audio equipment) for compact, high-density PCBs.
- Automotive modules where temperature stability and reliability are critical.
- Medical devices leveraging its precision and low thermal drift.
- Communication hardware (routers, switches) for impedance matching and filtering.
Conclusion of 4814P-2-471
The Bourns 4814P-2-471 stands out for its combination of precision, compactness, and reliability, making it a superior choice for designs demanding reduced board space and simplified routing. Its bussed architecture cuts BOM costs, while industrial-grade specs ensure longevity in demanding applications. Engineers can trust this component for repeatable performance in both prototyping and mass production.



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