


Bourns, Inc.
4814P-2-473
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4814P-2-473 Description
4814P-2-473 Description
The 4814P-2-473 from Bourns Inc. is a high-performance 13-resistor bussed array designed for precision surface-mount applications. Encased in a compact 14-pin SOIC package with dimensions of 0.390" x 0.220" (9.91mm x 5.59mm) and a low-profile height of 0.094" (2.40mm), this component is optimized for space-constrained PCB designs. It features a 47kΩ resistance per element with a tight ±2% tolerance and a stable ±100ppm/°C temperature coefficient, ensuring reliable performance across varying environmental conditions. The device operates at 80mW power per element and is rated for MSL 1 (Unlimited) moisture sensitivity, making it suitable for extended storage and handling.
4814P-2-473 Features
- 13-resistor bussed network simplifies circuit design by reducing component count.
- 47kΩ ±2% tolerance delivers consistent signal integrity in precision applications.
- Low-profile (2.40mm) and compact footprint ideal for high-density layouts.
- ±100ppm/°C temperature stability ensures minimal drift in harsh environments.
- 80mW power rating per resistor balances performance and thermal management.
- Surface-mount (SOIC) packaging enables automated assembly processes.
- REACH compliant and EAR99/ECCN classified for global regulatory adherence.
4814P-2-473 Applications
This resistor array excels in applications requiring stable, matched resistances with minimal board space, including:
- Voltage division networks in sensor interfaces and ADC/DAC circuits.
- Pull-up/pull-down resistor arrays for digital logic and microcontroller I/Os.
- Signal conditioning in industrial automation and instrumentation.
- Consumer electronics, such as smart devices, where compactness and reliability are critical.
- Automotive electronics, leveraging its robust temperature performance.
Conclusion of 4814P-2-473
The 4814P-2-473 stands out as a space-efficient, high-precision solution for modern electronics, combining Bourns' reliability with optimized electrical characteristics. Its bussed configuration, tight tolerance, and low thermal drift make it superior to discrete resistors in multi-channel designs. Whether for industrial, automotive, or consumer applications, this array ensures reduced BOM complexity, improved consistency, and enhanced manufacturability. Active status and REACH compliance further solidify its suitability for global supply chains.



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