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4816P-2-102F

4816P-2-102F Description

The 4816P-2-102F from Bourns Inc. is a high-performance 15-resistor bussed network housed in a compact 16-pin SOIC package. Designed for surface-mount applications, this resistor array offers a 1kΩ resistance per element with a tight ±1% tolerance, ensuring precision in circuit design. Its ±100ppm/°C temperature coefficient provides stable performance across varying thermal conditions, making it suitable for environments with fluctuating temperatures. The device operates at 80mW power per element and features a moisture sensitivity level (MSL) of 1, allowing unlimited floor life under typical storage conditions. With dimensions of 11.18mm x 5.59mm (0.440" x 0.220") and a low-profile 2.40mm (0.094") seated height, it is ideal for space-constrained PCB layouts.

4816P-2-102F Features

• 15-resistor bussed network in a 16-pin SOIC package for efficient circuit integration.
• 1kΩ resistance with ±1% tolerance for high accuracy.
• Low TCR (±100ppm/°C) ensures minimal resistance drift over temperature variations.
• 80mW power rating per element for reliable performance in low-power applications.
• Compact footprint (11.18mm x 5.59mm) and low profile (2.40mm) for high-density PCB designs.
• MSL 1 (Unlimited) for extended shelf life without moisture protection requirements.
• REACH and RoHS compliance, meeting environmental and regulatory standards.

4816P-2-102F Applications

This resistor array is optimized for precision analog and digital circuits, including:

• Voltage dividers and pull-up/pull-down networks in microcontroller systems.
• Signal conditioning in sensor interfaces and data acquisition systems.
• Impedance matching in communication modules and RF circuits.
• Industrial automation and consumer electronics where space efficiency and reliability are critical.
• Medical devices requiring stable, low-drift resistance networks.

Conclusion of 4816P-2-102F

The 4816P-2-102F stands out as a high-density, precision resistor array with excellent thermal stability and compact form factor. Its bussed configuration simplifies PCB routing, while its low TCR and tight tolerance ensure consistent performance in demanding applications. Ideal for space-constrained, high-reliability designs, this Bourns product is a robust choice for engineers seeking a balance of performance, durability, and ease of integration.