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4816P-2-224LF

4816P-2-224LF Description

The 4816P-2-224LF from Bourns Inc. is a high-performance 15-resistor bussed network housed in a compact 16-pin SOIC package. Designed for surface-mount applications, this resistor array offers a 220k Ohm resistance per element with a tight ±2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. Its 80mW power rating per element and low-profile 0.094" (2.40mm) height make it suitable for space-constrained designs. The device is RoHS3 compliant, REACH unaffected, and rated MSL 1 (Unlimited), guaranteeing reliability in automated assembly processes.

4816P-2-224LF Features

• Bussed Circuit Configuration: Simplifies PCB layout by connecting multiple resistors to a common node, reducing component count.
• High-Density Packaging: Compact 0.440" x 0.220" (11.18mm x 5.59mm) footprint optimizes board space.
• Wide Operating Range: ±100ppm/°C TCR ensures minimal resistance drift under thermal stress.
• Robust Construction: Tape & Reel (TR) packaging supports high-volume pick-and-place assembly.
• Industry-Standard Compliance: Meets ROHS3, REACH, and EAR99/ECCN requirements for global deployment.

4816P-2-224LF Applications

Ideal for precision analog circuits, voltage dividers, and pull-up/pull-down networks in:

• Industrial Control Systems: Signal conditioning and sensor interfacing.
• Consumer Electronics: Keypad matrices and LED driver circuits.
• Telecommunications: Line termination and impedance matching.
• Automotive Electronics: ECU modules where stable resistance under temperature fluctuations is critical.

Conclusion of 4816P-2-224LF

The 4816P-2-224LF stands out for its balance of precision, power handling, and compactness, making it a versatile choice for modern electronics. Its bussed architecture reduces design complexity, while Bourns' quality assurance ensures long-term reliability. Whether for high-volume manufacturing or mission-critical systems, this resistor network delivers consistent performance with minimal footprint overhead.