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4816P-2-241LF

4816P-2-241LF Description

The 4816P-2-241LF from Bourns Inc. is a high-performance 15-resistor bussed network housed in a compact 16-pin SOIC package. Designed for surface-mount applications, it features a 240-ohm resistance per element with a tight ±2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The device operates at 80mW power per element and is rated for unlimited moisture sensitivity (MSL 1), making it suitable for industrial and commercial use. Its RoHS3 compliance and REACH unaffected status further enhance its suitability for modern electronics.

4816P-2-241LF Features

• Compact Design: Measures 0.440" x 0.220" (11.18mm x 5.59mm) with a low-profile 0.094" (2.40mm) height, ideal for space-constrained PCB layouts.
• High Reliability: Bussed circuit configuration simplifies design while maintaining consistent performance.
• Broad Compatibility: Tape & Reel (TR) packaging enables efficient automated assembly processes.
• Robust Performance: ±100ppm/°C TCR ensures minimal resistance drift over temperature fluctuations.
• Industry-Standard Compliance: Meets ROHS3 and EAR99 requirements for global deployment.

4816P-2-241LF Applications

This resistor network excels in signal conditioning, voltage division, and pull-up/pull-down circuits in:

• Industrial Control Systems: Precision resistance networks for sensor interfaces.
• Consumer Electronics: Space-saving solutions for compact devices like wearables.
• Automotive Electronics: Reliable performance in infotainment and ECU designs.
• Telecommunications: Stable termination and impedance matching in high-frequency circuits.

Conclusion of 4816P-2-241LF

The 4816P-2-241LF combines high density, precision, and reliability in a single package, making it a versatile choice for modern electronic designs. Its low-profile form factor, robust tolerance, and compliance with environmental standards position it as a superior alternative to discrete resistors or less stable arrays. Ideal for high-volume manufacturing, this component delivers consistent performance in demanding applications while streamlining assembly processes.