


Bourns, Inc.
4816P-T01-470
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4816P-T01-470 Description
4816P-T01-470 Description
The 4816P-T01-470 from Bourns Inc. is a high-performance 8-resistor network array designed for precision surface-mount applications. Housed in a compact 16-SOIC package with dimensions of 11.18mm x 5.59mm (0.440" x 0.220") and a low-profile height of 2.40mm (0.094"), this device offers excellent space efficiency for densely populated PCBs. Each resistor in the array features a 47Ω resistance with a tight ±1Ω tolerance, ensuring consistent performance in critical circuits. The isolated circuit configuration allows independent use of each resistor, while the ±250ppm/°C temperature coefficient ensures stability across varying thermal conditions. With a 160mW power rating per element, this array is ideal for low-to-moderate power applications.
4816P-T01-470 Features
- 8 isolated resistors in a single 16-pin SOIC package, reducing component count and PCB footprint.
- 47Ω ±1Ω resistance with ±250ppm/°C TCR, providing high precision and thermal reliability.
- Surface-mount design (11.18mm x 5.59mm) with MSL 1 (Unlimited) moisture sensitivity, suitable for automated assembly.
- 160mW power dissipation per resistor, balancing performance and thermal management.
- REACH compliant and EAR99/ECCN classified, ensuring global regulatory adherence.
- Tube packaging for secure handling and storage.
4816P-T01-470 Applications
This resistor network excels in applications requiring precision resistance matching and space optimization, such as:
- Voltage division and current limiting in analog/digital signal conditioning.
- Pull-up/pull-down networks in microcontroller and FPGA circuits.
- Sensor interfacing and amplification in industrial control systems.
- Medical electronics, where consistent performance and miniaturization are critical.
- Automotive electronics, leveraging its robust thermal performance and reliability.
Conclusion of 4816P-T01-470
The Bourns 4816P-T01-470 resistor network array stands out for its compact design, precision tolerances, and isolated configuration, making it a versatile solution for modern electronics. Its low thermal drift, high power handling, and compliance with industry standards ensure reliable operation in demanding environments. Whether used in consumer electronics, industrial systems, or automotive applications, this component delivers performance, efficiency, and space savings—key advantages for engineers prioritizing both functionality and board real estate.



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