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4816P-T01-683

4816P-T01-683 Description

The 4816P-T01-683 from Bourns Inc. is a high-performance 8-resistor network array designed for precision surface-mount applications. Encased in a compact 16-pin SOIC package, this device features isolated resistors with a 68kΩ resistance value, ±2% tolerance, and a low ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. With dimensions of 11.18mm x 5.59mm (0.440" x 0.220") and a low-profile 2.40mm (0.094") seated height, it is optimized for space-constrained PCB designs. The 160mW power rating per element and MSL 1 (Unlimited) moisture sensitivity make it suitable for industrial and commercial applications requiring reliability and durability.

4816P-T01-683 Features

• 8 isolated resistors in a single 16-pin SOIC package, reducing component count and board space.
• 68kΩ resistance with ±2% tolerance for precision circuit design.
• Low TCR (±100ppm/°C) ensures minimal resistance drift over temperature fluctuations.
• Compact footprint (11.18mm x 5.59mm) and 2.40mm height ideal for high-density layouts.
• 160mW power dissipation per resistor for robust performance in demanding applications.
• MSL 1 (Unlimited) rating allows extended floor life without baking.
• REACH compliant and EAR99/ECCN classified for global regulatory adherence.

4816P-T01-683 Applications

This resistor network is ideal for:

• Analog signal conditioning in sensor interfaces and data acquisition systems.
• Voltage division and pull-up/down networks in digital logic circuits.
• Industrial automation where stable resistance values are critical under thermal stress.
• Consumer electronics, including smart devices and IoT modules, requiring compact, reliable passive components.
• Medical instrumentation demanding precision and long-term stability.

Conclusion of 4816P-T01-683

The 4816P-T01-683 stands out as a reliable, space-saving solution for precision resistor networks, combining Bourns' quality with high electrical performance. Its isolated design, low TCR, and robust power handling make it superior to generic arrays, particularly in applications requiring thermal stability and miniaturization. Whether for industrial, medical, or consumer electronics, this component delivers consistent performance while simplifying PCB assembly and reducing BOM complexity.