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4818P-2-102

4818P-2-102 Description

The 4818P-2-102 from Bourns Inc. is a high-performance 17-resistor bussed network housed in an 18-pin SOIC package, designed for precision surface-mount applications. With a 1kΩ resistance per element and a tight ±2% tolerance, this device ensures reliable signal conditioning and voltage division in compact circuits. Its ±100ppm/°C temperature coefficient guarantees stable performance across varying environmental conditions, while the 80mW power rating per resistor balances efficiency with thermal management. The 0.094" (2.40mm) low-profile height and 0.490" x 0.220" (12.45mm x 5.59mm) footprint make it ideal for space-constrained PCB designs. Packaged in Tape & Reel (TR), it supports automated assembly processes, enhancing manufacturing efficiency.

4818P-2-102 Features

• 17-resistor bussed array simplifies circuit design by reducing component count.
• 1kΩ resistance with ±2% tolerance for precise voltage division and current limiting.
• ±100ppm/°C temperature coefficient ensures minimal drift in harsh environments.
• 80mW power dissipation per element balances performance and thermal reliability.
• Compact 18-SOIC package (12.45mm x 5.59mm) with a 2.40mm max height for high-density layouts.
• MSL 1 (Unlimited) moisture sensitivity, suitable for extended storage and handling.
• REACH Affected and EAR99/ECCN compliant, meeting global regulatory standards.

4818P-2-102 Applications

This resistor network excels in:

• Analog signal conditioning in sensor interfaces and data acquisition systems.
• Voltage division networks for ADCs, DACs, and reference circuits.
• Pull-up/pull-down resistor arrays in microcontroller and FPGA designs.
• Industrial automation and automotive electronics, where stability under temperature fluctuations is critical.
• Consumer electronics, such as wearables and IoT devices, leveraging its compact form factor.

Conclusion of 4818P-2-102

The 4818P-2-102 combines precision, compactness, and reliability, making it a standout choice for engineers seeking robust resistor networks. Its bussed architecture, low thermal drift, and industry-standard packaging streamline integration into high-volume production. Whether for industrial, automotive, or consumer applications, this Bourns offering delivers consistent performance while minimizing board space and BOM complexity.