


Bourns, Inc.
4818P-2-200
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4818P-2-200 Description
4818P-2-200 Description
The 4818P-2-200 from Bourns Inc. is a high-performance 17-resistor bussed network housed in an 18-pin SOIC package, designed for precision surface-mount applications. With a compact footprint of 12.45mm x 5.59mm (0.490" x 0.220") and a low-profile height of 2.40mm (0.094"), this resistor array is ideal for space-constrained PCB designs. It features a 20Ω resistance per element with a tight ±1Ω tolerance and a ±250ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The device operates at 80mW power per element and is rated for MSL 1 (Unlimited) moisture sensitivity, making it suitable for extended storage and handling.
4818P-2-200 Features
- 17-resistor bussed network in an 18-pin SOIC configuration for simplified circuit design.
- 20Ω resistance with ±1Ω tolerance for high precision in signal conditioning and termination.
- ±250ppm/°C temperature coefficient ensures minimal drift in demanding thermal environments.
- Compact 12.45mm x 5.59mm footprint with 2.40mm height, optimized for dense PCB layouts.
- 80mW power rating per element and MSL 1 (Unlimited) moisture sensitivity for robust reliability.
- Tape & Reel (TR) packaging for automated assembly efficiency.
- REACH Affected and EAR99/ECCN compliant, meeting global regulatory standards.
4818P-2-200 Applications
The 4818P-2-200 is particularly suited for:
- Signal termination and pull-up/pull-down networks in digital communication systems.
- Voltage divider circuits in sensor interfaces and ADC/DAC applications.
- Impedance matching in high-speed data lines and RF modules.
- Industrial automation and consumer electronics, where space efficiency and reliability are critical.
- Medical devices and automotive electronics, benefiting from its stable thermal performance.
Conclusion of 4818P-2-200
The 4818P-2-200 resistor array stands out for its precision, compact design, and robust performance, making it a superior choice for engineers seeking reliability in high-density PCB applications. Its bussed architecture, tight tolerance, and low thermal drift provide significant advantages over discrete resistors, reducing component count and assembly complexity. Whether for industrial, automotive, or consumer electronics, this Bourns network delivers consistent performance in demanding environments.



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