


Bourns, Inc.
4820P-2-102
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4820P-2-102 Description
4820P-2-102 Description
The 4820P-2-102 from Bourns Inc. is a high-performance 19-resistor bussed array designed for precision surface-mount applications. With a compact footprint of 13.72mm x 5.59mm (0.540" x 0.220") and a low-profile height of 2.40mm (0.094"), this component is ideal for space-constrained PCB designs. It features a 1kΩ resistance per element, a tight ±2% tolerance, and a stable ±100ppm/°C temperature coefficient, ensuring reliable performance across varying environmental conditions. The device is rated for 80mW power per element and complies with REACH and EAR99 regulations, making it suitable for global markets. Packaged in Tape & Reel (TR), it supports automated assembly processes.
4820P-2-102 Features
- 19-resistor bussed network in a 20-pin SOIC package for efficient circuit integration.
- 1kΩ resistance with ±2% tolerance for precision applications.
- Low thermal drift (±100ppm/°C) ensures stability in temperature-sensitive environments.
- Compact SMT design (13.72mm x 5.59mm) saves board space.
- 80mW power rating per resistor balances performance and thermal management.
- MSL 1 (Unlimited) moisture sensitivity allows extended shelf life and handling flexibility.
- REACH and RoHS compliant, meeting stringent environmental standards.
4820P-2-102 Applications
This resistor array excels in analog signal conditioning, voltage division, and pull-up/pull-down networks in:
- Industrial control systems requiring stable, high-density resistor networks.
- Consumer electronics (e.g., smart devices, displays) where space and reliability are critical.
- Automotive electronics for sensor interfaces and ECU signal processing.
- Medical devices demanding precision and low thermal drift.
- Telecom infrastructure for impedance matching and termination circuits.
Conclusion of 4820P-2-102
The 4820P-2-102 combines high density, precision, and reliability in a surface-mount package, making it a superior choice for modern electronics. Its bussed architecture, tight tolerance, and robust thermal performance distinguish it from generic arrays, while its compliance with industry standards ensures broad applicability. Ideal for high-volume automated assembly, this component is a versatile solution for designers prioritizing efficiency and performance.



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