


Bourns, Inc.
4820P-2-203
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4820P-2-203 Description
4820P-2-203 Description
The 4820P-2-203 from Bourns Inc. is a high-performance 19-resistor bussed network housed in a compact 20-pin SOIC package, designed for surface-mount applications. With a 20kΩ resistance per element and a tight ±2% tolerance, this device ensures reliable signal conditioning and voltage division in precision circuits. Its ±100ppm/°C temperature coefficient guarantees stable performance across varying thermal conditions, while the 80mW power rating per element accommodates moderate power dissipation needs. The 0.094" (2.40mm) low-profile height and 13.72mm x 5.59mm footprint make it ideal for space-constrained PCB designs.
4820P-2-203 Features
- 19-resistor bussed array simplifies circuit design by reducing component count.
- 20kΩ resistance with ±2% tolerance for high accuracy in voltage division and pull-up/down applications.
- ±100ppm/°C TCR ensures minimal resistance drift over temperature.
- 80mW power dissipation per resistor balances performance and thermal management.
- Surface-mount SOIC package (20-pin) with Tape & Reel (TR) packaging for automated assembly efficiency.
- Moisture Sensitivity Level (MSL) 1 allows unlimited floor life, reducing handling constraints.
- REACH compliant and EAR99 classified for global regulatory adherence.
4820P-2-203 Applications
This resistor network excels in:
- Analog signal conditioning (e.g., sensor interfaces, ADC/DAC circuits).
- Voltage division networks in power supplies and measurement systems.
- Pull-up/down resistor arrays for digital I/O lines in microcontrollers and FPGAs.
- Industrial automation and consumer electronics, where space and reliability are critical.
- Medical devices requiring stable, low-drift resistance values.
Conclusion of 4820P-2-203
The 4820P-2-203 combines precision, compactness, and robustness, making it a superior choice for applications demanding high-density resistor networks with consistent performance. Its bussed architecture, low thermal drift, and industry-standard packaging streamline integration while reducing BOM complexity. Ideal for high-reliability systems, this Bourns offering stands out for its balance of accuracy, power handling, and ease of assembly.



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