


Bourns, Inc.
4820P-2-392
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
4820P-2-392 Description
4820P-2-392 Description
The 4820P-2-392 from Bourns Inc. is a high-performance 19-resistor bussed array designed for precision surface-mount applications. With a 3.9kΩ resistance per element and a tight ±2% tolerance, this component ensures reliable signal conditioning and voltage division in compact PCB designs. Housed in a 20-pin SOIC package with dimensions of 13.72mm x 5.59mm (0.540" x 0.220"), it offers a low-profile seated height of 2.40mm (0.094"), making it suitable for space-constrained environments. The device operates within a ±100ppm/°C temperature coefficient, ensuring stability across varying thermal conditions. Compliant with REACH and ECCN EAR99, it is ideal for industrial and consumer electronics requiring robust, long-term performance.
4820P-2-392 Features
- 19-resistor bussed network with 80mW power rating per element for balanced current distribution.
- Surface-mount (SOIC) package with Tape & Reel (TR) packaging for automated assembly efficiency.
- Moisture Sensitivity Level (MSL) 1 (Unlimited), ensuring no baking is required before use.
- Low TCR (±100ppm/°C) for minimal resistance drift in temperature-sensitive applications.
- Compact footprint (13.72mm x 5.59mm) optimizes board space without sacrificing performance.
- RoHS-compliant and REACH-affected, meeting stringent environmental standards.
4820P-2-392 Applications
- Voltage dividers in sensor interfaces and ADC/DAC circuits.
- Pull-up/pull-down networks for microcontrollers and digital logic systems.
- Signal termination in high-speed communication PCBs (e.g., USB, LVDS).
- Industrial control systems requiring stable resistance under thermal stress.
- Consumer electronics (e.g., smart home devices, wearables) where space and reliability are critical.
Conclusion of 4820P-2-392
The 4820P-2-392 stands out for its high-density integration, precision tolerance, and thermal stability, making it a superior choice over discrete resistors in multi-channel designs. Its bussed architecture simplifies layout while reducing component count, and its MSL 1 rating ensures hassle-free storage and handling. Whether for industrial automation or compact consumer devices, this resistor array delivers repeatable performance and space savings, aligning with modern PCB miniaturization trends.



.png)
















.png?x-oss-process=image/format,webp/resize,h_32)










